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MM908E621ACDWBR2 Datasheet(PDF) 7 Page - Freescale Semiconductor, Inc |
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MM908E621ACDWBR2 Datasheet(HTML) 7 Page - Freescale Semiconductor, Inc |
7 / 65 page Analog Integrated Circuit Device Data Freescale Semiconductor 7 908E621 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS THERMAL RATINGS Operating Ambient Temperature(3) TA -40 to 85 °C Operating Junction Temperature(4) TJ -40 to 125 °C Storage Temperature TSTG -40 to 150 °C Peak Package Reflow Temperature During Reflow(6), (7) TPPRT Note 7 °C Notes 3. The limiting factor is junction temperature; taking into account the power dissipation, thermal resistance, and heat sinking. 4. The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because of higher power dissipation on the analog die. The analog die temperature must not exceed 150°C under these conditions. 5. Pin soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 6. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 7. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. Table 2. Maximum Ratings (continued) All voltages are with respect to ground unless otherwise noted. Exceeding limits on any pin may cause permanent damage to the device. Rating Symbol Value Unit |
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