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MP3V5050GP Datasheet(PDF) 4 Page - Freescale Semiconductor, Inc |
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MP3V5050GP Datasheet(HTML) 4 Page - Freescale Semiconductor, Inc |
4 / 11 page MP3V5050 Sensors 4 Freescale Semiconductor Figure 3 illustrates the Differential/Gauge Sensing Chip in the basic chip carrier (Case 482). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MP3V5050 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0° to 85°C using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range. Figure 4 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 2. Output versus Pressure Differential Figure 3. Cross-Sectional Diagram SOP (not to scale) Figure 4. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646.) Differential Pressure (kPa) 3 2 1 0 0 5 10 15 20 25 30 35 40 45 55 50 Transfer Function: Vout = VS*(0.018*P+0.04) ± ERROR VS = 3.0 Vdc TEMP = 0 to 85°C TYPICAL MIN MAX 3 V 1.0 µF 0.01 µF 470 pF GND Vs Vout IPS OUTPUT FLUOROSILICONE GEL DIE COAT WIRE BOND DIFFERENTIAL SENSING ELEMENT THERMOPLASTIC CASE STAINLESS STEEL CAP LEAD FRAME P1 P2 DIE BOND DIE |
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