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MP3V5050GP Datasheet(PDF) 4 Page - Freescale Semiconductor, Inc

Part # MP3V5050GP
Description  Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
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Manufacturer  FREESCALE [Freescale Semiconductor, Inc]
Direct Link  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MP3V5050GP Datasheet(HTML) 4 Page - Freescale Semiconductor, Inc

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MP3V5050
Sensors
4
Freescale Semiconductor
Figure 3 illustrates the Differential/Gauge Sensing Chip in
the basic chip carrier (Case 482). A fluorosilicone gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm.
The MP3V5050 series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 2 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 4. The
output will saturate outside of the specified pressure range.
Figure 4 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 2. Output versus Pressure Differential
Figure 3. Cross-Sectional Diagram SOP
(not to scale)
Figure 4. Recommended Power Supply Decoupling
and Output Filtering
(For additional output filtering, please refer to
Application Note AN1646.)
Differential Pressure (kPa)
3
2
1
0
0
5
10
15
20
25
30
35
40
45
55
50
Transfer Function:
Vout = VS*(0.018*P+0.04) ± ERROR
VS = 3.0 Vdc
TEMP = 0 to 85°C
TYPICAL
MIN
MAX
3 V
1.0
µF
0.01
µF
470 pF
GND
Vs
Vout
IPS
OUTPUT
FLUOROSILICONE
GEL DIE COAT
WIRE BOND
DIFFERENTIAL
SENSING ELEMENT
THERMOPLASTIC
CASE
STAINLESS
STEEL CAP
LEAD
FRAME
P1
P2
DIE BOND
DIE


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