MPX53GP datasheet(6/8 Pages) FREESCALE

Part #	MPX53GP

Description	50 kPa Uncompensated Silicon Pressure Sensors

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Manufacturer	FREESCALE [Freescale Semiconductor, Inc]

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MPX53

Sensors

6

Freescale Semiconductor

Pressure

PACKAGE DIMENSIONS

CASE 344-15

ISSUE AA

UNIBODY PACKAGE

CASE 344B-01

ISSUE B

UNIBODY PACKAGE

NOTES:

1.

2.

3.

DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

CONTROLLING DIMENSION: INCH.

DIMENSION -A- IS INCLUSIVE OF THE MOLD

STOP RING. MOLD STOP RING NOT TO EXCEED

16.00 (0.630).

M

A

M

0.136 (0.005)

T

1

234

PIN 1

R

N

L

G

F

D 4 PL

SEATING

PLANE

-T-

C

M

J

B

-A-

DAMBAR TRIM ZONE:

F

THIS IS INCLUDED

WITHIN DIM. "F" 8 PL

1

23

4

Y

Z

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

A

0.595

0.630

15.11

16.00

B

0.514

0.534

13.06

13.56

C

0.200

0.220

5.08

5.59

D

0.016

0.020

0.41

0.51

F

0.048

0.064

1.22

1.63

G

0.100 BSC

2.54 BSC

J

0.014

0.016

0.36

0.40

L

0.695

0.725

17.65

18.42

M

30˚ NOM

N

0.475

0.495

12.07

12.57

R

0.430

0.450

10.92

11.43

Y

0.048

0.052

1.22

1.32

Z

0.106

0.118

2.68

3.00

NOTES:

1.

2.

DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

CONTROLLING DIMENSION: INCH.

D 4 PL

F

U

H

L

PORT #1

POSITIVE

PRESSURE

(P1)

PIN 1

-A-

-Q-

S

K

G

-P-

S

Q

M

0.25 (0.010)

T

S

M

0.13 (0.005)

Q S

T

12

3 4

SEATING

PLANE

B

N

R

C

J

-T-

STYLE 1:

PIN 1. GROUND

2. + OUTPUT

3. + SUPPLY

4 - OUTPUT

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

A

1.145

1.175

29.08

29.85

B

0.685

0.715

17.40

18.16

C

0.305

0.325

7.75

8.26

D

0.016

0.020

0.41

0.51

F

0.048

0.064

1.22

1.63

G

0.100 BSC

2.54 BSC

H

0.182

0.194

4.62

4.93

J

0.014

0.016

0.36

0.41

K

0.695

0.725

17.65

18.42

L

0.290

0.300

7.37

7.62

N

0.420

0.440

10.67

11.18

P

0.153

0.159

3.89

4.04

Q

0.153

0.159

3.89

4.04

R

0.230

0.250

5.84

6.35

S

U

0.910 BSC

23.11 BSC

0.220

0.240

5.59

6.10

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