© 2006 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FSQ0365, FSQ0265, FSQ0165, FSQ321, FSQ311 Rev. 1.0.5

5

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-

ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-

tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The

Notes:

6. Repetitive rating: Pulse width limited by maximum junction temperature.

8. Meets JEDEC standards JESD22-A114 and JESD22-A115.

Thermal Impedance

Notes:

9. All items are tested with the standards JESD 51-2 and 51-10 (DIP).

10. Free-standing, with no heat-sink, under natural convection.

11. Infinite cooling condition - refer to the SEMI G30-88.

12. Measured on the package top surface.

Symbol

Characteristic

Min.

Max.

Unit

500

V

Drain Pin Voltage

650

V

Supply Voltage

20

V

Feedback Voltage Range

-0.3

9.0

V

Sync Pin Voltage Range

-0.3

9.0

V

FSQ0365

12

A

FSQ0265

8

FSQ0165

4

FSQ321/311

1.5

FSQ0365

230

mJ

FSQ0265

140

FSQ0165

50

FSQ321/311

10

Total Power Dissipation

1.5

W

Recommended Operating Junction Temperature

-40

Internally limited

°C

Operating Ambient Temperature

-40

85

°C

Storage Temperature

-55

150

°C

ESD

CLASS1 C

CLASS B

Symbol

Parameter

Value

Unit

Junction-to-Ambient Thermal Resistance

80

°C/W

Junction-to-Case Thermal Resistance

20

Junction-to-Top Thermal Resistance

35