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M5M5T5672TG-20 Datasheet(PDF) 5 Page - Renesas Technology Corp

Part # M5M5T5672TG-20
Description  18874368-BIT(262144-WORD BY 72-BIT) NETWORK SRAM
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

M5M5T5672TG-20 Datasheet(HTML) 5 Page - Renesas Technology Corp

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MITSUBISHI LSIs
M5M5T5672TG – 25,22,20
18874368-BIT(262144-WORD BY 72-BIT) NETWORK SRAM
4/25
Preliminary
M5M5T5672TG REV.0.1
PIN FUNCTION
Pin
Name
Function
A0~A17
Synchronous
Address
Inputs
These inputs are registered and must meet the setup and hold times around the rising edge of
CLK. A0 and A1 are the two least significant bits (LSB) of the address field and set the internal
burst counter if burst is desired.
BWa#, BWb#,
BWc#, BWd#,
Bwe#, BWf#,
BWg#, BWh#
Synchronous
Byte Write
Enables
These active LOW inputs allow individual bytes to be written when a WRITE cycle is active and
must meet the setup and hold times around the rising edge of CLK. BYTE WRITEs need to be
asserted on the same cycle as the address. BWs are associated with addresses and apply to
subsequent data. BWa# controls DQa, DQPa pins; BWb# controls DQb, DQPb pins; BWc#
controls DQc, DQPc pins; BWd# controls DQd, DQPd pins; BWe# controls DQe, DQPe pins;
BWf# controls DQf, DQPf pins; BWg# controls DQg, DQPg pins; BWh# controls DQh, DQPh pins.
CLK
Clock Input
This signal registers the address, data, chip enables, byte write enables and burst control inputs
on its rising edge.
All synchronous inputs must meet setup and hold times around the clock's rising edge.
E1#
Synchronous
Chip Enable
This active LOW input is used to enable the device and is sampled only when a new external
address is loaded (ADV is LOW).
E2
Synchronous
Chip Enable
This active HIGH input is used to enable the device and is sampled only when a new external
address is loaded (ADV is LOW). This input can be used for memory depth expansion.
E3#
Synchronous
Chip Enable
This active LOW input is used to enable the device and is sampled only when a new external
address is loaded (ADV is LOW). This input can be used for memory depth expansion.
CKE#
Synchronous
Clock Enable
This active LOW input permits CLK to propagate throughout the device. When HIGH, the device
ignores the CLK input and effectively internally extends the previous CLK cycle. This input must
meet setup and hold times around the rising edge of CLK.
G#
Output Enable
This active LOW asynchronous input enable the data I/O output drivers.
ADV
Synchronous
Address
Advance/Load
When HIGH, this input is used to advance the internal burst counter, controlling burst access after
the external address is loaded. When HIGH, W# is ignored. A LOW on this pin permits a new
address to be loaded at CLK rising edge.
ZZ
Snooze
Enable
This active HIGH asynchronous input causes the device to enter a low-power standby mode in
which all data in the memory array is retained. When active, all other inputs are ignored. When
this pin is LOW or NC, the SRAM normally operates.
W#
Synchronous
Read/Write
This active input determines the cycle type when ADV is LOW. This is the only means for
determining READs and WRITEs. READ cycles may not be converted into WRITEs (and vice
versa) other than by loading a new address. A LOW on the pin permits BYTE WRITE operations
and must meet the setup and hold times around the rising edge of CLK. Full bus width WRITEs
occur if all byte write enables are LOW.
DQa,DQPa,DQb,DQPb,
DQc,DQPc,DQd,DQPd,
DQe,DQPe,DQf,DQPf,
DQg,DQPg,DQh,DQPh
Synchronous
Data I/O
Byte “a” is DQa , DQPa pins; Byte “b” is DQb, DQPb pins; Byte “c” is DQc, DQPc pins; Byte “d” is
DQd,DQPd pins; Byte “e” is DQe, DQPe pins; Byte “f” is DQf, DQPf pins; Byte “g” is DQg, DQPg
pins; Byte “h” is DQh, DQPh pins. Input data must meet setup and hold times around CLK rising
edge.
LBO#
Burst Mode
Control
This DC operated pin allows the choice of either an interleaved burst or a linear burst. If this pin is
HIGH or NC, an interleaved burst occurs. When this pin is LOW, a linear burst occurs, and input
leak current to this pin.
VDD
VDD
Core Power Supply
VSS
VSS
Ground
VDDQ
VDDQ
I/O buffer Power supply
TDI
Test Data Input
TDO
Test Data Output
TCK
Test Clock
TMS
Test Mode Select
These pins are used for Boundary Scan Test.
NC
No Connect
These pins are not internally connected and may be connected to ground.


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