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H8S2670 Datasheet(PDF) 4 Page - Renesas Technology Corp |
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H8S2670 Datasheet(HTML) 4 Page - Renesas Technology Corp |
4 / 979 page Rev. 3.00 Mar 17, 2006 page iv of l Configuration of This Manual This manual comprises the following items: 1. General Precautions on Handling of Product 2. Configuration of This Manual 3. Preface 4. Main Revisions in This Edition 5. Contents 6. Overview 7. Description of Functional Modules • CPU and System-Control Modules • On-Chip Peripheral Modules The configuration of the functional description of each module differs according to the module. However, the generic style includes the following items: i) Feature ii) Input/Output Pin iii) Register Description iv) Operation v) Usage Note When designing an application system that includes this LSI, take notes into account. Each section includes notes in relation to the descriptions given, and usage notes are given, as required, as the final part of each section. 8. List of Registers 9. Electrical Characteristics 10. Appendix The list of revisions is a summary of points that have been revised or added to earlier versions. This does not include all of the revised contents. For details, see the actual locations in this manual. 11. Index |
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