WSLP

Low Value (down to 0.001

Ω), Surface Mount

Vishay Dale

Document Number: 30122

For technical questions, contact: ww2bresistors@vishay.com

www.vishay.com

Revision: 18-Nov-08

11

DIMENSIONS

Note

• Embossed Carrier Tape per EIA-481-2

L

T

W

H

l

b

a

MODEL

DIMENSIONS in inches [millimeters]

LW

H

T

WSLP0805

0.080 ± 0.010 0.050 ± 0.010 0.013 ± 0.010 0.015 ± 0.010

[2.03 ± 0.254] [1.27 ± 0.254] [0.330 ± 0.254] [0.381 ± 0.254]

WSLP1206

0126 ± 0.010 0.063 ± 0.010 0.025 ± 0.010 0.020 ± 0.010

[3.20 ± 0.254] [1.60 ± 0.254] [0.635 ± 0.254] [0.508 ± 0.254]

MODEL

SOLDER PAD DIMENSIONS in inches [millimeters]

ab

l

WSLP0805

0.040

0.050

0.020

[1.02]

[1.27]

[0.50]

WSLP1206

0.062

0.070

0.030

[1.57]

[1.78]

[0.76]

Derating

120

100

80

60

40

20

0

- 65

Ambient Temperature in °C

70

- 50

- 25

75

0

150

100

170

125

25

50

PERFORMANCE

TEST

CONDITIONS OF TEST

TEST LIMITS

Thermal Shock

- 55 °C to + 150 °C, 1000 cycles, 15 min at each extreme

± (0.5 % + 0.0005

Ω) ΔR

Low Temperature Operation

- 65 °C for 45 min

± (0.5 % + 0.0005

Ω) ΔR

High Temperature Exposure

1000 h at + 170 °C

± (1.0 % + 0.0005

Ω) ΔR

Bias Humidity

+ 85 °C, 85 % RH, 10 % Bias, 1000 h

± (0.5 % + 0.0005

Ω) ΔR

Mechanical Shock

100 g’s for 6 ms, 5 pulses

± (0.5 % + 0.0005

Ω) ΔR

Vibration

Frequency varied 10 to 2000 Hz in 1 min, 3 directions, 12 h

± (0.5 % + 0.0005

Ω) ΔR

Load Life

1000 h at 70 °C, 1.5 h “ON”, 0.5 h “OFF”

± (1.0 % + 0.0005

Ω) ΔR

Resistance to Solder Heat

+ 260 °C Solder, 10 - 12 s dwell, 25 mm/s emergence

± (0.5 % + 0.0005

Ω) ΔR

Moisture Resistance

MIL-STD-202, Method 106, 0 % power, 7b not required

± (0.5 % + 0.0005

Ω) ΔR

PACKAGING

MODEL

REEL

TAPE WIDTH

DIAMETER

PIECES/REEL

CODE

WSLP0805

8 mm/Punched Paper

178 mm/7"

5000

EA

WSLP1206

8 mm/Embossed Plastic

178 mm/7"

4000

EA