ZXTC2061E6

Issue 2 - October 2008

2

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© Diodes Incorporated 2008

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Absolute maximum and thermal ratings

NOTES:

(a) For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in

still air conditions.

(b) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in

still air conditions.

(c) For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in

still air conditions.

(d) As above measured at t<5 seconds.

(e) Repetitive rating - pulse width limited by maximum junction temperature. Refer to Transient Thermal Impedance

graph.

(f) For device with one active die, both collectors attached to a common sink.

(g) For device with two active dice running at equal power, split sink 50% to each collector.

PARAMETER

Symbol

Limit

Unit

Collector-base voltage

20(-12)

V

Collector-emitter voltage

12(-12)

V

Emitter-base voltage

7(-7)

V

Continuous collector current(c)(f)

5(-3.5)

A

Peak pulse current

12(-10)

A

Base current

1(-1)

A

Linear derating factor

0.7

5.6

W

mW/

°C

Linear derating factor

0.9

7.2

W

mW/

°C

Linear derating factor

1.1

8.8

W

mW/

°C

Linear derating factor

1.1

8.8

W

mW/

°C

Linear derating factor

1.7

13.6

W

mW/

°C

Operating and storage temperature range

-55 to +150

°C

Thermal resistance junction to ambient(a)(f)

179

°C/W

Thermal resistance junction to ambient(b)(f)

139

°C/W

Thermal resistance junction to ambient(b)(g)

113

°C/W

Thermal resistance junction to ambient(c)(f)

113

°C/W

Thermal resistance junction to ambient(d)(f)

73

°C/W