085 CS

Vishay BCcomponents

Aluminum Capacitors

SMD (Chip) Standard

www.vishay.com

For technical questions, contact: aluminumcaps1@vishay.com

Document Number: 28300

2

Revision: 28-May-08

DIMENSIONS in millimeters

PACKAGING

Tape on reel packaging: 2000 per reel

Detailed tape dimensions see section ‘PACKAGING’

MOUNTING

The capacitors are designed for automatic placement on

printed-circuit boards or hybrid circuits.

Optimum dimensions of soldering pads depend upon

soldering method, mounting accuracy, print lay-out and/or

adjacent components.

For

recommended

pad

dimensions,

refer

to Fig.

3

andTable2.

Table 2

2 max.

2 max.

2 max.

9 max.

a.

12.2 max.

b.

2 max.

3.9

max.

3.9

max.

3.9

max.

2.7

max.

2.7

max.

2.7

max.

2.7

max.

4.1

max.

4.1

max.

3.9

max.

7.5

10.8

a. Case size 8.8 x 3.7 x 3.9 mm

b. Case size 11.9 x 3.7 x 3.9 mm

Fig.2 Dimensional outlines

RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters (placement accuracy ± 0.25 mm)

NOMINAL CASE SIZE

L x W x H

FOR REFLOW SOLDERING

FOR WAVE SOLDERING

AB

CD

E

F

G

A

B

C

D

E

F

G

8.8 x 3.7 x 3.9

9.7

3.5

2.9

2.5

3.0

10.1

4.4

13.5

4.1

4.7

3.7

2.9

14.0

8.4

11.9 x 3.7 x 3.9

12.9

6.5

2.9

2.5

6.0

13.3

4.4

16.8

7.4

4.7

3.7

6.1

17.3

8.4

solder land/

solder paste

pattern

solder resist

pattern

occupied

area

tracks or

dummy tracks

E

D

G

C

B

A

F

E

D

G

C

B

A

F

reflow soldering

wave soldering

Fig.3 Recommended pad dimensions for reflow and wave soldering