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MAL215095612E3 Datasheet(PDF) 2 Page - Vishay Siliconix |
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MAL215095612E3 Datasheet(HTML) 2 Page - Vishay Siliconix |
2 / 7 page 150 CLZ Vishay BCcomponents Aluminum Capacitors SMD (Chip), Very Low Z www.vishay.com For technical questions, contact: aluminumcaps1@vishay.com Document Number: 28304 2 Revision: 03-Jul-08 Table 1 Table 2 Note 1. Detailed tape dimensions see section “PACKAGING”. MOUNTING The capacitors are designed for automatic placement on to printed-circuit boards. Optimum dimensions of soldering pads depend amongst others on soldering method, mounting accuracy, print layout and/or adjacent components. For recommended soldering pad dimensions, refer to Fig.3 and Table 3. SOLDERING Soldering conditions are defined by the curve, temperature versus time, where the temperature is that measured on the soldering pad during processing. For maximum conditions refer to Fig.4. Any temperature versus time curve which does not exceed the specified maximum curves may be applied. Table 3 AS A GENERAL PRINCIPLE, TEMPERATURE AND DURATION SHALL BE THE MINIMUM NECESSARY REQUIRED TO ENSURE GOOD SOLDERING CONNECTIONS. HOWEVER, THE SPECIFIED MAXIMUM CURVES SHOULD NEVER BE EXCEEDED. DIMENSIONS in millimeters AND MASS NOMINAL CASE SIZE Lx Wx H CASE CODE Lmax. Wmax. Hmax. Ø D Bmax. SL1 max. MASS (g) 8 x 8 x 10 0810 8.5 8.5 10.5 8.0 1.0 3.1 9.9 ≈ 1.0 10 x 10 x 10 1010 10.5 10.5 10.5 10.0 1.0 4.5 11.8 ≈ 1.3 10 x 10 x 14 1014 10.5 10.5 14.3 10.0 1.0 4.5 11.8 ≈ 1.5 0.4 ± 0.2 W B CS L C 0.3 max. Fig.2 Dimensional outline TAPE AND REEL DIMENSIONS in millimeters, PACKAGING QUANTITIES NOMINAL CASE SIZE LxW x H CASE CODE PITCH P1 TAPE WIDTH W TAPE THICKNESS T2 REEL DIA. PACKAGING QUANTITY PER REEL 8 x 8 x 10 0810 16 24 11.3 380 500 10 x 10 x 10 1010 16 24 11.3 380 500 10 x 10 x 14 1014 16 24 14.8 330 250 RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters CASE CODE a b c 0810 3.5 2.5 3.0 1010 4.3 2.5 4.0 1014 4.3 2.5 4.0 Fig.3 Recommended solder pad dimensions 280 260 240 220 200 180 160 140 120 100 80 0 50 100 150 200 250 Fig.4 Maximum temperature load during infrared reflow soldering measured on the soldering pad t (s) T PAD (°C) |
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