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TFBS4650-TR4 Datasheet(PDF) 8 Page - Vishay Siliconix

Part # TFBS4650-TR4
Description  Infrared Transceiver 9.6 kbit/s to 115.2 kbit/s (SIR)
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Manufacturer  VISHAY [Vishay Siliconix]
Direct Link  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

TFBS4650-TR4 Datasheet(HTML) 8 Page - Vishay Siliconix

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TFBS4650
Document Number 84672
Rev. 1.2, 28-May-08
Vishay Semiconductors
www.vishay.com
8
For technical questions within your region, please contact one of the following:
irdasupportAM@vishay.com, irdasupportAP@vishay.com, irdasupportEU@vishay.com
Recommended Solder Profiles
Solder Profile for Sn/Pb soldering
Lead (Pb)-Free, Recommended Solder Profile
The TFBS4650 is a lead (Pb)-free transceiver and
qualified for lead (Pb)-free processing. For lead
(Pb)-free solder paste like Sn(3.0-4.0)Ag(0.5-0.9)Cu,
there are two standard reflow profiles: Ramp-Soak-
Spike (RSS) and Ramp-To-Spike (RTS). The Ramp-
Soak-Spike profile was developed primarily for reflow
ovens heated by infrared radiation. With widespread
use of forced convection reflow ovens the Ramp-To-
Spike profile is used increasingly. Shown below in
figure 3 is VISHAY's recommended profiles for use
with the TFBS4650 transceivers. For more details
please refer to Application note: SMD Assembly
Instruction.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be
recommended because the risk of damage is highly
dependent on the experience of the operator.
Nevertheless, we added a chapter to the above
mentioned
application
note,
describing
manual
soldering and desoldering.
Storage
The storage and drying processes for all VISHAY
transceivers
(TFDUxxxx
and
TFBSxxx)
are
equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
Figure 2. Recommended Solder Profile for Sn/Pb Soldering
0
20
40
60
80
100
120
140
160
180
200
220
240
260
0
50
100
150
200
250
300
350
Time/s
2...4 °C/s
2...4 °C/s
10 s max. at 230 °C
120 s...180 s
160 °C max.
240 °C max.
90 s max.
19431
Figure 3. Solder Profile, RSS Recommendation
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
0
50
100
150
200
250
300
350
Time/s
20 s
2 °C...4 °C/s
2 °C...4 °C/s
90 s...120 s
T
≥ 217 °C for 50 s max
Tpeak = 260 °C max.
50 s max.
T
≥ 255 °C for 20 s max
19261


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