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TFBS4650-TR4 Datasheet(PDF) 8 Page - Vishay Siliconix |
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TFBS4650-TR4 Datasheet(HTML) 8 Page - Vishay Siliconix |
8 / 14 page TFBS4650 Document Number 84672 Rev. 1.2, 28-May-08 Vishay Semiconductors www.vishay.com 8 For technical questions within your region, please contact one of the following: irdasupportAM@vishay.com, irdasupportAP@vishay.com, irdasupportEU@vishay.com Recommended Solder Profiles Solder Profile for Sn/Pb soldering Lead (Pb)-Free, Recommended Solder Profile The TFBS4650 is a lead (Pb)-free transceiver and qualified for lead (Pb)-free processing. For lead (Pb)-free solder paste like Sn(3.0-4.0)Ag(0.5-0.9)Cu, there are two standard reflow profiles: Ramp-Soak- Spike (RSS) and Ramp-To-Spike (RTS). The Ramp- Soak-Spike profile was developed primarily for reflow ovens heated by infrared radiation. With widespread use of forced convection reflow ovens the Ramp-To- Spike profile is used increasingly. Shown below in figure 3 is VISHAY's recommended profiles for use with the TFBS4650 transceivers. For more details please refer to Application note: SMD Assembly Instruction. Wave Soldering For TFDUxxxx and TFBSxxxx transceiver devices wave soldering is not recommended. Manual Soldering Manual soldering is the standard method for lab use. However, for a production process it cannot be recommended because the risk of damage is highly dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned application note, describing manual soldering and desoldering. Storage The storage and drying processes for all VISHAY transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4. The data for the drying procedure is given on labels on the packing and also in the application note "Taping, Labeling, Storage and Packing" (http://www.vishay.com/docs/82601/82601.pdf). Figure 2. Recommended Solder Profile for Sn/Pb Soldering 0 20 40 60 80 100 120 140 160 180 200 220 240 260 0 50 100 150 200 250 300 350 Time/s 2...4 °C/s 2...4 °C/s 10 s max. at 230 °C 120 s...180 s 160 °C max. 240 °C max. 90 s max. 19431 Figure 3. Solder Profile, RSS Recommendation 0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 0 50 100 150 200 250 300 350 Time/s 20 s 2 °C...4 °C/s 2 °C...4 °C/s 90 s...120 s T ≥ 217 °C for 50 s max Tpeak = 260 °C max. 50 s max. T ≥ 255 °C for 20 s max 19261 |
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