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Document Number: 81471

316

Rev. 1.2, 04-Sep-08

VSMG3700

Vishay Semiconductors

High Speed Infrared Emitting Diode, RoHS

Compliant, 850 nm, GaAlAs Double Hetero

Fig. 9 - Blister Tape

Fig. 10 - Tape Dimensions in mm for PLCC-2

MISSING DEVICES

A maximum of 0.5 % of the total number of components per

reel may be missing, exclusively missing components at the

beginning and at the end of the reel. A maximum of three

consecutive components may be missing, provided this gap

is followed by six consecutive components.

Fig. 11 - Beginning and End of Reel

The tape leader is at least 160 mm and is followed by a

carrier tape leader with at least 40 empty compartments. The

tape leader may include the carrier tape as long as the cover

tape is not connected to the carrier tape. The least

component is followed by a carrier tape trailer with a least 75

empty compartments and sealed with cover tape.

Fig. 12 - Dimensions of Reel-GS08

Fig. 13 - Dimensions of Reel-GS18

COVER TAPE REMOVAL FORCE

The removal force lies between 0.1 N and 1.0 N at a removal

speed of 5 mm/s. In order to prevent components from

popping out of the blisters, the cover tape must be pulled off

at an angle of 180° with regard to the feed direction.

Adhesive tape

Component cavity

Blister tape

94 8670

1.85

1.65

4.0

3.6

3.6

3.4

2.05

1.95

1.6

1.4

4.1

3.9

4.1

3.9

5.75

5.25

8.3

7.7

3.5

3.1

2.2

2.0

0.25

94 8668

De-reeling direction

Tape leader

min. 75 empty

compartments

> 160 mm

40 empty

compartments

Carrier leader

Carrier trailer

94 8158

180

178

4.5

3.5

2.5

1.5

13.00

12.75

63.5

60.5

14.4 max.

10.0

9.0

120°

94 8665

Identification

Label:

Vishay

type

group

tape code

production

code

quantity

321

329

Identification

4.5

3.5

2.5

1.5

13.00

12.75

62.5

60.0

14.4 max.

10.4

8.4

120°

18857

Label:

Vishay

type

group

tape code

production

code

quantity