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Y162712K7560TW0R Datasheet(PDF) 2 Page - Vishay Siliconix

Part # Y162712K7560TW0R
Description  Ultra High Precision Foil Wraparound Surface Mount Chip Resistor with TCR of 짹 0.05 ppm/째C and Power Coefficient of 5 ppm at
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Manufacturer  VISHAY [Vishay Siliconix]
Direct Link  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

Y162712K7560TW0R Datasheet(HTML) 2 Page - Vishay Siliconix

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VSMP Series (0805, 1206, 1506, 2010,
Vishay Foil Resistors
Ultra High Precision Foil Wraparound Surface Mount Chip
Resistor with TCR of ± 0.05 ppm/°C and Power Coefficient of
5 ppm at Rated Power and Load Life Stability of ± 0.005 % (50 ppm)
www.vishay.com
For any questions, contact: foil@vishay.com
Document Number: 63060
2
Revision: 18-Sep-08
Note
1. Land Pattern Dimensions are per IPC-7351A
Note
1. As shown + 0.01
Ω to allow for measurement errors at low values.
FIGURE 2 - TRIMMING TO VALUES
(Conceptual Illustration)
Mutual Inductance
Reduction due
to Change in
Current Direction
Current Path
Before Trimming
Note: Foil shown in black, etched spaces in white
Interloop Capacitance
Reduction in Series
Trimming Process
Removes this Material
from Shorting Strip Area
Changing Current Path
and Increasing
Resistance
Current Path
After Trimming
FIGURE 3 -TYPICAL TCR CURVE Z-FOIL
Note
• The TCR values for < 100
Ω are influenced by the termination
composition and result in deviation from this curve.
+ 500
+ 200
+ 100
0
- 100
- 200
- 300
- 500
- 55
- 25
+ 25
+ 60
+ 75
+ 100
+ 125
Ambient Temperature (°C)
ΔR
R
(ppm)
0
0.05 ppm/°C
- 0.1 ppm/°C
0.1 ppm/°C
0.14 ppm/°C
0.2 ppm/°C
- 0.16 ppm/°C
- 400
+ 300
+ 400
TABLE 2 - DIMENSIONS AND LAND PATTERN in inches (millimeters)
CHIP
SIZE
L
± 0.005 (0.13)
W
± 0.005 (0.13)
THICKNESS
MAXIMUM
D
± 0.005 (0.13)
Z1)
MAXIMUM
G1)
MINIMUM
X1)
MAXIMUM
0805
0.080 (2.03)
0.050 (1.27)
0.025 (0.64)
0.015 (0.38)
0.122 (3.10)
0.028 (0.71)
0.050 (1.27)
1206
0.126 (3.20)
0.062 (1.57)
0.025 (0.64)
0.020 (0.51)
0.175 (4.45)
0.059 (1.50)
0.071 (1.80)
1506
0.150 (3.81)
0.062 (1.57)
0.025 (0.64)
0.020 (0.51)
0.199 (5.05)
0.083 (2.11)
0.071 (1.80)
2010
0.198 (5.03)
0.097 (2.46)
0.025 (0.64)
0.025 (0.64)
0.247 (6.27)
0.115 (2.92)
0.103 (2.62)
2512
0.249 (6.32)
0.127 (3.23)
0.025 (0.64)
0.032 (0.81)
0.291 (7.39)
0.150 (3.81)
0.127 (3.23)
Recommended Land Pattern
Footprint
G
Z
X
Top View
D
T
W
L
TABLE 3 - SPECIFICATIONS
CHIP
SIZE
RATED
POWER
(mW)
at + 70 °C
MAX
VOLTAGE
RATING
(
)
RESISTANCE
RANGE
(
Ω)
MAXIMUM
WEIGHT
(mg)
0805
200
49 V
10 to 12K
6
1206
300
95 V
10 to 30K
11
1506
300
110 V
10 to 40K
12
2010
500
200 V
10 to 100K
27
2512
750
220 V
10 to 150K
40
PR
×
TABLE 4 - LOAD LIFE STABILITY
(+ 70 °C for 2000 h)
CHIP SIZE
MAXIMUM
ΔR LIMITS
0805
± 0.005 % at 100 mW
± 0.01 % at 200 mW
1206, 1506
± 0.005 % at 150 mW
± 0.01 % at 300 mW
2010
± 0.005 % at 200 mW
± 0.01 % at 500 mW
2512
± 0.005 % at 500 mW
± 0.01 % at 750 mW
TABLE 5 - PERFORMANCES
TEST OR CONDITIONS
MIL-PRF-55342
CHARACTERISTIC E
ΔR LIMITS
TYPICAL
ΔR LIMITS
MAXIMUM
ΔR LIMITS1)
Thermal Shock
± 0.1 %
± 0.005 % (50 ppm)
± 0.01 % (100 ppm)
Low Temperature Operation
± 0.1 %
± 0.005 % (50 ppm)
± 0.01 % (100 ppm)
Short Time Overload
± 0.1 %
± 0.005 % (50 ppm)
± 0.01 % (100 ppm)
High Temperature Exposure
± 0.1 %
± 0.01 % (100 ppm)
± 0.02 % (200 ppm)
Resistance to Soldering Heat
± 0.2 %
± 0.005 % (50 ppm)
± 0.01 % (100 ppm)
Moisture Resistance
± 0.2 %
± 0.005 % (50 ppm)
± 0.02 % (200 ppm)
Load Life Stability + 70 °C for 2000 h at Rated Power
± 0.5 %
± 0.005 % (50 ppm)
± 0.01 % (100 ppm)


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