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ADA4932-1 Datasheet(PDF) 7 Page - Analog Devices |
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ADA4932-1 Datasheet(HTML) 7 Page - Analog Devices |
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7 / 28 page  ADA4932-1/ADA4932-2 Rev. 0 | Page 7 of 28 ABSOLUTE MAXIMUM RATINGS Table 7. Parameter Rating Supply Voltage 11 V Power Dissipation See Figure 4 Input Current, +IN, −IN, PD ±5 mA Storage Temperature Range −65°C to +125°C Operating Temperature Range ADA4932-1 −40°C to +105°C ADA4932-2 −40°C to +105°C Lead Temperature (Soldering, 10 sec) 300°C Junction Temperature 150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is specified for the device (including exposed pad) soldered to a high thermal conductivity 2s2p circuit board, as described in EIA/JESD 51-7. Table 8. Thermal Resistance Package Type θ JA Unit ADA4932-1, 16-Lead LFCSP (Exposed Pad) 91 °C/W ADA4932-2, 24-Lead LFCSP (Exposed Pad) 65 °C/W MAXIMUM POWER DISSIPATION The maximum safe power dissipation in the ADA4932-x package is limited by the associated rise in junction temperature (TJ) on the die. At approximately 150°C, which is the glass transition temperature, the plastic changes its properties. Even temporarily exceeding this temperature limit can change the stresses that the package exerts on the die, permanently shifting the parametric performance of the ADA4932-x. Exceeding a junction temperature of 150°C for an extended period can result in changes in the silicon devices, potentially causing failure. The power dissipated in the package (PD) is the sum of the quiescent power dissipation and the power dissipated in the package due to the load drive. The quiescent power is the voltage between the supply pins (VS) times the quiescent current (IS). The power dissipated due to the load drive depends upon the particular application. The power due to load drive is calculated by multiplying the load current by the associated voltage drop across the device. RMS voltages and currents must be used in these calculations. Airflow increases heat dissipation, effectively reducing θJA. In addition, more metal directly in contact with the package leads/ exposed pad from metal traces, through holes, ground, and power planes reduces θJA. Figure 4 shows the maximum safe power dissipation in the package vs. the ambient temperature for the single 16-lead LFCSP (91°C/W) and the dual 24-lead LFCSP (65°C/W) on a JEDEC standard 4-layer board with the exposed pad soldered to a PCB pad that is connected to a solid plane. 3.5 0 0.5 1.0 1.5 2.0 2.5 3.0 –40 100 80 60 40 20 0 –20 AMBIENT TEMPERATURE (°C) ADA4932-1 ADA4932-2 Figure 4. Maximum Power Dissipation vs. Ambient Temperature for a 4-Layer Board ESD CAUTION |
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Similar Description - ADA4932-1 |
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