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MC34716 Datasheet(PDF) 5 Page - Freescale Semiconductor, Inc

Part # MC34716
Description  1.0 MHz Dual Switch-Mode DDR Power Supply
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Manufacturer  FREESCALE [Freescale Semiconductor, Inc]
Direct Link  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MC34716 Datasheet(HTML) 5 Page - Freescale Semiconductor, Inc

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Analog Integrated Circuit Device Data
Freescale Semiconductor
5
34716
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Input Supply Voltage (VIN) Pin
VIN
-0.3 to 7.0
V
High Side MOSFET Drain Voltage (PVIN1, PVIN2) Pins
PVIN
-0.3 to 7.0
V
Switching Node (SW1, SW2) Pins
VSW
-0.3 to 7.0
V
BOOT1, BOOT2 Pins (Referenced to SW1, SW2 Pins Respectively)
VBOOT - VSW
-0.3 to 7.0
V
PG, VOUT1, VOUT2, SD, and STBY Pins
-
-0.3 to 7.0
V
VDDI, FREQ, ILIM1, INV1, INV2, COMP1, COMP2, VREFIN, and VREFOUT
Pins
-
-0.3 to 3.0
V
Channel 1 Continuous Output Current(1)
IOUT1
+5.0
A
Channel 2 Continuous Output Current(1)
IOUT2
±3.0
A
ESD Voltage(2)
Human Body Model
Machine Model (MM)
Charge Device Model
VESD1
VESD2
VESD3
±2000
±200
±750
V
THERMAL RATINGS
Operating Ambient Temperature(3)
TA
-40 to 85
°C
Storage Temperature
TSTG
-65 to +150
°C
Peak Package Reflow Temperature During Reflow(4),(5)
TPPRT
Note 5
°C
Maximum Junction Temperature
TJ(MAX)
+150
°C
Power Dissipation (TA = 85°C)
(6)
PD
2.03
W
Notes
1.
Continuous output current capability so long as TJ is ≤ TJ(MAX).
2.
ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 Ω), the Machine Model (MM)
(CZAP = 200 pF, RZAP = 0 Ω), and the Charge Device Model (CDM), Robotic (CZAP = 4.0 pF).
3.
The limiting factor is junction temperature, taking into account power dissipation, thermal resistance, and heatsinking.
4.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
5.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
6.
Maximum power dissipation at indicated ambient temperature.


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