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TS3USB30E Datasheet(PDF) 1 Page - Texas Instruments |
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TS3USB30E Datasheet(HTML) 1 Page - Texas Instruments |
1 / 15 page 1 FEATURES APPLICATIONS RSWPACKAGE (TOP VIEW) 1 2 5 8 4 9 3 10 6 7 D– GND D+ OE V CC S RSWPACKAGE (BOTTOMVIEW) D+ 1 2 3 10 4 9 5 8 6 7 GND D– S V CC OE DESCRIPTION/ORDERING INFORMATION TS3USB30E www.ti.com........................................................................................................................................................................................... SCDS255 – DECEMBER 2008 ESD PROTECTED, HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH WITH SINGLE ENABLE • V CC Operation at 3 V to 4.3 V • 1.8-V Compatible Control-Pin Inputs • I OFF Supports Partial Power-Down-Mode Operation – D+/D- Pins Tolerate up to 5.25V • r on = 10 Ω Max • Δr on = 0.35 Ω Typ • C io(ON) = 7.5 pF Typ • Low Power Consumption (1 µA Max) • –3dB Bandwidth = 900 MHz Typ • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II • ESD Performance Tested Per JESD 22 – 8000-V Human-Body Model (A114-B, Class II) – 1000-V Charged-Device Model (C101) • ESD Performance I/O Port to GND (1) – 15000-V Human-Body Model • Packaged in 10-pin TQFN (1.4 mm × 1.8 mm) • Routes Signals for USB 1.0, 1.1, and 2.0 (1) High-voltage HBM is performed in addition to the standard HBM testing (A114-B, Class II) and applies to I/O ports tested with respect to GND only. The TS3USB30E is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (900 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps). The TS3USB30E integrates ESD protection cells on all pins, is available in a tiny µQFN package (1.8 mm × 1.4 mm) and is charaterized over the free air temperature range from –40°C to 85°C. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Copyright © 2008, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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