MAX19999ETX+ datasheet(2/19 Pages) MAXIM

Part #	MAX19999ETX+

Description	Dual, SiGe High-Linearity, 3000MHz to 4000MHz Downconversion Mixer with LO Buffer

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Manufacturer	MAXIM [Maxim Integrated Products]

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Dual, SiGe High-Linearity, 3000MHz to

4000MHz Downconversion Mixer with LO Buffer

2

_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

+5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS

(

Typical Application Circuit, no input RF or LO signals applied, VCC = +4.75V to +5.25V, TC = -40°C to +85°C. Typical values are at

VCC = +5.0V, TC = +25°C, unless otherwise noted. R1 = R4 = 750Ω, R2 = R5 = 698Ω.)

+3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS

(

Typical Application Circuit, no input RF or LO signals applied, TC = -40°C to +85°C. Typical values are at

VCC = +3.3V, TC = +25°C, unless otherwise noted. R1, R4 = 1.1kΩ; R2, R5 = 845Ω.) (Note 5)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

VCC to GND ...........................................................-0.3V to +5.5V

RF_, LO to GND.....................................................-0.3V to +0.3V

IFM_, IFD_, IFM_SET, IFD_SET, LO_ADJ_M,

LO_ADJ_D to GND.................................-0.3V to (VCC + 0.3V)

RF_, LO Input Power ......................................................+15dBm

RF_, LO Current (RF and LO are DC shorted to GND

through balun).................................................................50mA

Continuous Power Dissipation (Note 1) ..............................8.7W

θJA (Notes 2, 3)..............................................................+38°C/W

θJC (Note 3).....................................................................7.4°C/W

Operating Case Temperature Range

(Note 4) ...................................................TC = -40°C to +85°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage

VCC

4.75

5

5.25

V

Supply Current

ICC

Total supply current

388

420

mA

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage

VCC

(Note 6)

3

3.3

3.6

V

Supply Current

ICC

Total supply current

279

mA

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

RF Frequency

fRF

(Notes 5, 7)

3000

4000

MHz

LO Frequency

fLO

(Notes 5, 7)

2650

3700

MHz

Using Mini-Circuits TC4-1W-17 4:1

transformer as defined in the Typical

Application Circuit, IF matching

components affect the IF frequency range

(Notes 5, 7)

100

500

IF Frequency

fIF

Using alternative Mini-Circuits TC4-1W-7A

4:1 transformer, IF matching components

affect the IF frequency range (Notes 5, 7)

50

250

MHz

LO Drive Level

PLO

(Note 7)

-3

+3

dBm

Note 1: Based on junction temperature TJ = TC + (

θJC x VCC x ICC). This formula can be used when the temperature of the exposed

pad is known while the device is soldered down to a PCB. See the

Applications Information section for details. The junction

temperature must not exceed +150°C.

Note 2: Junction temperature TJ = TA + (

θJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is

known. The junction temperature must not exceed +150°C.

Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

Note 4: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.

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