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CY23S08
Document #: 38-07265 Rev. *H
Page 9 of 10
Package Drawings and Dimensions
Figure 9. 16-Pin (150-Mil) SOIC S16
Figure 10. 16-Pin Thin Shrunk Small Outline Package (4.40 MM Body) Z16
PIN 1 ID
0°~8°
1
8
916
SEATING PLANE
0.230[5.842]
0.244[6.197]
0.157[3.987]
0.150[3.810]
0.386[9.804]
0.393[9.982]
0.050[1.270]
BSC
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.0098[0.249]
0.0138[0.350]
0.0192[0.487]
0.016[0.406]
0.035[0.889]
0.0075[0.190]
0.0098[0.249]
DIMENSIONS IN INCHES[MM] MIN.
MAX.
0.016[0.406]
0.010[0.254]
X 45°
0.004[0.102]
REFERENCE JEDEC MS-012
PART #
S16.15 STANDARD PKG.
SZ16.15 LEAD FREE PKG.
PACKAGE WEIGHT 0.15gms
51-85068-*B
4.90[0.193]
1.10[0.043] MAX.
0.65[0.025]
0.20[0.008]
0.05[0.002]
16
PIN 1 ID
6.50[0.256]
SEATING
PLANE
1
0.076[0.003]
6.25[0.246]
4.50[0.177]
4.30[0.169]
BSC.
5.10[0.200]
0.15[0.006]
0.19[0.007]
0.30[0.012]
0.09[[0.003]
BSC
0.25[0.010]
0°-8°
0.70[0.027]
0.50[0.020]
0.95[0.037]
0.85[0.033]
PLANE
GAUGE
51-85091-*A
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