BLF571_1

© NXP B.V. 2008. All rights reserved.

Preliminary data sheet

Rev. 01 — 11 December 2008

8 of 13

NXP Semiconductors

BLF571

HF / VHF power LDMOS transistor

8.2 Test circuit

[1]

American Technical Ceramics type 100B or capacitor of same quality.

[2]

Printed-Circuit Board (PCB): Rogers 5880;

thickness copper plating = 35

µm.

Table 9.

List of components

All capacitors should be soldered vertically. For test circuit, see Figure 9 and Figure 10.

Component

Description

Value

Remarks

C1, C3, C4,

C5, C14

multilayer ceramic chip capacitor 100 pF

[1]

C2

multilayer ceramic chip capacitor 39 pF

[1]

C6

multilayer ceramic chip capacitor 68 pF

[1]

C7, C9

multilayer ceramic chip capacitor 1 nF

[1]

C8

multilayer ceramic chip capacitor 4.7 F

TDK C4532X7R1E475MT020U or equivalent

C10

multilayer ceramic chip capacitor 8.2 pF

[1]

C11

electrolytic capacitor

470 F

C12

multilayer ceramic chip capacitor 33 pF

[1]

C13

multilayer ceramic chip capacitor 15 pF

[1]

L1

1 turn enamelled copper wire

D = 5.5 mm;

d=1mm;

length=1mm

L2

2 turns enamelled copper wire

D = 3.5 mm;

d=1mm;

length=3mm

L3

5 turns enamelled copper wire

D=6mm;

d=1mm;

length=5mm

L4

3.3 turns enamelled copper wire

D=3mm;

d=1mm;

length=4mm

L5

3 turns enamelled copper wire

D=3mm;

d=1mm;

length=3mm

L6

stripline

-

[2]

(L

× W) 16.5 mm × 2.4 mm

L7, L8, L10,

L11, L17, L19,

L20

stripline

-

[2]

(L

× W) 3.0 mm × 5.0 mm

L9

stripline

-

[2]

(L

× W) 43.0 mm × 2.4 mm

L12, L15

stripline

-

[2]

(L

× W) 3.5 mm × 2.4 mm

L13, L14

stripline

-

[2]

(L

× W) 8.0 mm × 8.0 mm

L16

stripline

-

[2]

(L

× W) 3.0 mm × 5.9 mm

L18

stripline

-

[2]

(L

× W) 27.0 mm × 2.4 mm

L21

stripline

-

[2]

(L

× W) 28.5 mm × 2.4 mm

R1

metal film resistor

1000

Ω; 0.6 W