CBT16212_2

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 02 — 3 November 2008

8 of 12

NXP Semiconductors

CBT16212

24-bit bus exchange switch with 12-bit output enables

12. Package outline

Fig 7.

Package outline SOT364-1 (TSSOP56)

UNIT

QZ

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

0.15

0.05

0.2

0.1

8

0

o

o

0.1

DIMENSIONS (mm are the original dimensions).

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

SOT364-1

99-12-27

03-02-19

θ

A

D

Q

detail X

E

Z

e

c

L

X

(A )

3

0.25

128

56

29

y

pin 1 index

b

H

1.05

0.85

0.28

0.17

0.2

0.1

14.1

13.9

6.2

6.0

0.5

1

8.3

7.9

0.50

0.35

0.5

0.1

0.08

0.25

0.8

0.4

p

E

A

TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm

SOT364-1

A

max.

1.2

0

2.5

5 mm

scale

MO-153