HEF40098B_5

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 05 — 31 October 2008

8 of 12

NXP Semiconductors

HEF40098B

3-state hex inverting buffer

13. Package outline

Fig 7.

Package outline SOT38-4 (DIP16)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

SOT38-4

95-01-14

03-02-13

c

(e )

1

A

L

e

D

Z

16

1

9

8

E

pin 1 index

b

0

5

10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

UNIT

A

max.

12

(1)

(1)

(1)

cD

E

e

M

Z

H

L

mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

min.

A

max.

b

max.

w

1.73

1.30

0.53

0.38

0.36

0.23

19.50

18.55

6.48

6.20

3.60

3.05

0.254

2.54

7.62

8.25

7.80

10.0

8.3

0.76

4.2

0.51

3.2

inches

0.068

0.051

0.021

0.015

0.014

0.009

1.25

0.85

0.049

0.033

0.77

0.73

0.26

0.24

0.14

0.12

0.01

0.1

0.3

0.32

0.31

0.39

0.33

0.03

0.17

0.02

0.13

DIP16: plastic dual in-line package; 16 leads (300 mil)

SOT38-4