DEVICE INFORMATION

AVAILABLE OPTIONS

1

REGIN

2

BAT

3

4

5

Vcc

6

Vss

TS

SE

12

11

10

9

SRN

8

SRP

7

REG25

SCL

SDA

HDQ

bq27541

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

PART NUMBER

PACKAGE

TA

COMMUNICATION

TAPE and REEL

FORMAT

QUANTITY

bq27541DRZR

3000

12-pin, 2,5-mm × 4-mm SON

–40°C to 85°C

bq27541DRZT

250

(1)

bq27541 is shipped in I2C mode

bq27541

(TOP VIEW)

TERMINAL FUNCTIONS

TERMINAL

DESCRIPTION

NAME

NO.

BAT

4

I

Cell-voltage measurement input. ADC input. Decouple with 0.1

µF capacitor.

REG25

2

P

2.5V output voltage of the internal integrated LDO. Connect a minimum 0.47

µF ceramic capacitor.

REGIN

3

P

The input voltage for the internal integrated LDO. Connect a 0.1

µF ceramic capacitor.

SCL

11

I

Ω

pull-up resistor (typical).

SDA

10

I/O

with 10 k

Ω pull-up resistor (typical).

SE

1

O

Shutdown Enable output. Open-drain.

HDQ

12

I/O

HDQ serial communications line (Slave). Open-drain.

SRN

8

IA

Analog input pin connected to the internal coulomb counter where SRN is nearest the PACK- connection.

Connect to 5-m

Ω to 20-mΩ sense resistor.

SRP

7

IA

Analog input pin connected to the internal coulomb counter where SRP is nearest the CELL- connection.

Connect to 5-m

Ω to 20-mΩ sense resistor

TS

9

IA

Pack thermistor voltage sense (use 103AT-type thermistor). ADC input

Vcc

5

P

Processor power input. The minimum 0.47

µF capacitor connected to REG25 should be close to Vcc.

Vss

6

P

Device ground

(1)

I/O = Digital input/output, IA = Analog input, P = Power connection

2

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Product Folder Link(s): bq27541