3

4533H–BLURF–07/07

T7024

Electrostatic sensitive device.

Observe precautions for handling.

5.

Handling

Do not operate this part near strong electrostatic fields. This IC meets class 1 ESD test require-

ment (HBM in accordance to EIA/JESD22-A114-A (October 97) and class A ESD test

requirement (MM) in accordance to EIA/JESD22-A115A.

3.

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating

only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this

specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Parameters

Symbol

Value

Unit

Supply voltage

Pins VS_LNA, V1_PA, V2_PA, V3_PA_OUT

6V

Junction temperature

T

j

150

°C

Storage temperature

T

stg

–40 to +125

°C

RF input power LNA

P

inLNA

5dBm

RF input power PA

P

inPA

10

dBm

4.

Thermal Resistance

Parameters

Symbol

Value

Unit

Junction ambient PSSOP20, slug soldered on PCB

R

thJA

19

K/W

Junction ambient QFN20, slug soldered on PCB

R

thJA

27

K/W

6.

Operating Range

All voltages are referred to ground (pins GND and slug). Power supply points are VS_LNA, V1_PA, V2_PA, V3_PA_OUT.

The table represents the sum of all supply currents depending on the TX/RX mode.

Parameters

Symbol

Min.

Typ.

Max.

Unit

Supply voltage

Pins V1_PA, V2_PA and V3_PA_OUT

2.7

3.0

4.6

V

Supply voltage, pin VS_LNA

V

S

2.7

3.0

5.5

V

Supply current TX, PSSO20

QFN20

Supply current RX

I

S

190

165

8

mA

mA

mA

Standby current, PU = 0

10

µA

Ambient temperature

–25

+25

+85

°C