1A

1Y

1

7

2A

2Y

3

5

3A

3Y

6

2

Absolute Maximum Ratings

(1)

SN74LVC3G07-EP

ORDERABLE PART NUMBER

–55°C to 125°C

VSSOP – DCU

Reel of 3000

SN74LVC3G07MDCUREP

SOCM

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(3)

The actual top-side marking has one additional character that designates the wafer fab/assembly site.

FUNCTION TABLE

(EACH BUFFER/DRIVER)

INPUT

OUTPUT

A

Y

H

H

L

L

LOGIC DIAGRAM (POSITIVE LOGIC)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage range

–0.5

6.5

V

Input voltage range

–0.5

6.5

V

–0.5

6.5

V

–0.5

6.5

V

Input clamp current

–50

mA

Output clamp current

–50

mA

Continuous output current

±50

mA

±100

mA

θ

JA

227

°C/W

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.

(3)

(4)

The package thermal impedance is calculated in accordance with JESD 51-7.

2

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