Frontier Electronics Corp.

667 E. COCHRAN STREET, SIMI VALLEY, CA 93065

TEL: (805) 522-9998

FAX: (805) 522-9989

E-mail: frontiersales@frontierusa.com

SMD Thin Film Chip Inductor:

P/N 0402TF-series

Rev. C

July. 05, 2008. Page: 7 of 7

F. Reel Specification:

φA

φB

φC

W

T

Quantity

178 ±1

60.2 ± 0.5

130. ± 0.50 13.2 ± 1.50 16.0 ± 0.20 10,000 PCS

G. Paper Tape Specification:

A

B

W

E

F

Po

P1

P2

φDo

T

0.67

±0.03

1.15

±0.03

8.00

±0.10

1.75

±0.05

3.50

±0.05

4.00

±0.10

2.00

±0.05

1.45

±0.05

1.5

±0.03

0.40

±0.03

H. Environmental Characteristics:

Tape & Reel Storage Temperature: 25ºC ± 3ºC, Humidity: < 80% RH.

ITEM

Specification

Test Method

JIS-C-5202-6.1.4

1 Bending Test

As SPEC.

Bending Amplitude 3mm for 10 seconds

MIL-STD-202F Method 301.

2 Dielectric Withstand Voltage

>100V

Apply 100VA (rms) for 1minute.

MIL-STD-202F Method 302

3 Insulation Resistance

>1000MΩ

Apply 100VDC for 1minute.

MIL-STD-202F Method 210E

4 Resistance to Soldering Heat

△≦

10%

260ºC ± 5ºC, 10±1seconds

JIS-C-5202-7.2

5 High Temperature Exposure

△≦

10%

85ºC ± 2ºC, 1000 +48/-0 hours

MIL-STD-202F Method 103B

6 Moisture Resistance

△≦

10%

40ºC ± 2ºC, 90~95%RH, 1000 +48/-0 hours

JIS-C-5202-7.1

7 Low Temperature Storage

△≦

10%

-40ºC ± 3ºC, 1000 +48/-0 hours

JIS-C-5202-7.4

8 Temperature Cycle

△≦

10%

-40/RT/85/RT, 10 cycles

MIL-STD-202F Method 208H

9 Solder-ability

95% min

coverage

245ºC ± 5ºC, 2 ± 0.5(sec)