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TMS320CC6713BGLZA20EP Datasheet(PDF) 11 Page - Texas Instruments |
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TMS320CC6713BGLZA20EP Datasheet(HTML) 11 Page - Texas Instruments |
11 / 123 page 3.2 Device Characteristics SM320C6713-EP SM320C6713B-EP FLOATING-POINT DIGITAL SIGNAL PROCESSORS www.ti.com SGUS049H – AUGUST 2003 – REVISED SEPTEMBER 2008 Table 3-2 provides an overview of the C6713/C6713B DSPs. The table shows significant features of each device, including the capacity of on-chip RAM, the peripherals, the execution time, and the package type with pin count. For more details on the C67x™ DSP device part numbers and part numbering, see Table 6-1 and Figure 6-1. Table 3-2. Characteristics of the C6713 and C6713B Processor C6713/C6713B INTERNAL CLOCK (FLOATING-POINT DSPs) HARDWARE FEATURES SOURCE GDP EMIF SYSCLK3 or ECLKIN 1 (32 bit) EDMA CPU clock frequency 1 (16 channels) Peripherals HPI (16 bit) SYSCLK2 1 Not all peripheral pins are available at the AUXCLK, same time. (For more details, see the McASPs 2 SYSCLK2(1) Device Configurations section.) Peripheral performance is dependent on I2Cs SYSCLK2 2 chip-level configuration. McBSPs SYSCLK2 2 32-bit timers = of SYSCLK2 2 GPIO module SYSCLK2 1 On-chip memory Size (Bytes) 264K 4K-Byte (KB) L1 program (L1P) cache 4KB L1 data (L1D) cache Organization 64KB unified L2 cache/mapped RAM 192KB L2 mapped RAM CPU ID+CPU Rev ID Control Status Register (CSR[31:16]) 0x0203 BSDL file For the C6713/13B BSDL file, contact your field sales representative. Frequency MHz 200 Time ns 5 ns Core (V) 1.26 V (C6713/C6713B) Voltage I/O (V) 3.3 V Prescaler /1, /2, /3, ..., /32 Clock generator options Multiplier ×4, ×5, ×6, ..., ×25 Postscaler /1, /2, /3, ..., /32 Package 27 mm × 27 mm 272-ball BGA (GDP) Process technology µm 0.13 Product status(2) Product preview (PP) PD (13) Advance information (AI) Production data (PD) (1) AUXCLK is the McASP internal high-frequency clock source for serial transfers. SYSCLK2 is the McASP system clock used for the clock check (high-frequency) circuit. (2) PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. ADVANCE INFORMATION concerns new products in the sampling or preproduction phase of development. Characteristic data and other specifications are subject to change without notice. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Submit Documentation Feedback DEVICE INFORMATION 11 |
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