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RFG45N06 Datasheet(PDF) 2 Page - Fairchild Semiconductor |
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RFG45N06 Datasheet(HTML) 2 Page - Fairchild Semiconductor |
2 / 8 page ©2002 Fairchild Semiconductor Corporation RFG45N06, RFP45N06, RF1S45N06SM Rev. B Absolute Maximum Ratings TC = 25oC, Unless Otherwise Specified RFG45N06, RFP45N06 RF1S45N06SM UNITS Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS 60 V Drain to Gate Voltage (RG = 20KΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR 60 V Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM 45 Refer to Peak Current Curve A Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS ±20 V Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EAS Refer to UIS Curve Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131 0.877 W W/oC Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG -55 to 175 oC Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tpkg 300 260 oC oC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. TJ = 25 oC to 150oC. Electrical Specifications TC = 25 oC, Unless Otherwise Specified PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS Drain to Source Breakdown Voltage BVDSS ID = 250µA, VGS = 0V (Figure 11) 60 - - V Gate Threshold Voltage VGS(TH) VGS = VDS, ID = 250µA (Figure 10) 2 - 4 V Zero Gate Voltage Drain Current IDSS VDS = Rated BVDSS, VGS = 0V - - 1 µA VDS = 0.8 x Rated BVDSS, VGS = 0V (125 oC) - - 25 µA Gate to Source Leakage Current IGSS VGS = ±20V - - ±100 nA Drain Source On Resistance (Note 2) rDS(ON) ID = 45A, VGS = 10V (Figure 9) - - 0.028 Ω Turn-On Time tON VDD = 30V, ID = 45A RL = 0.667Ω, VGS = +10V RG = 3.6Ω (Figure 13) - - 120 ns Turn-On Delay Time td(ON) -12- ns Rise Time tr -74- ns Turn-Off Delay Time td(OFF) -37- ns Fall Time tf -16- ns Turn-Off Time tOFF - - 80 ns Total Gate Charge Qg(TOT) VGS = 0 to 20V VDD = 48V, ID = 45A, RL = 1.07Ω Ig(REF) = 1.5mA (Figure 13) - 125 150 nC Gate Charge at 10V Qg(10) VGS = 0 to 10V - 67 80 nC Threshold Gate Charge Qg(TH) VGS = 0 to 2V - 3.7 4.5 nC Input Capacitance CISS VDS = 25V, VGS = 0V f = 1MHz (Figure 12) - 2050 - pF Output Capacitance COSS - 600 - pF Reverse Transfer Capacitance CRSS - 200 - pF Thermal Resistance Junction to Case RθJC - - 1.14 oC/W Thermal Resistance Junction to Ambient RθJA -- 80 oC/W Source to Drain Diode Specifications PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS Source to Drain Diode Voltage VSD ISD = 45A - - 1.5 V Diode Reverse Recovery Time trr ISD = 45A, dISD/dt = 100A/µs - - 125 ns NOTES: 2. Pulse test: pulse width ≤ 300µs, duty cycle ≤ 2%. 3. Repetitive rating: pulse width limited by maximum junction temperature. See Transient Thermal Impedance curve (Figure 3) and Peak Current Capability Curve (Figure 5). RFG45N06, RFP45N06, RF1S45N06SM |
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