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RFG45N06 Datasheet(PDF) 2 Page - Fairchild Semiconductor

Part # RFG45N06
Description  45A, 60V, 0.028 Ohm, N-Channel Power
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Manufacturer  FAIRCHILD [Fairchild Semiconductor]
Direct Link  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

RFG45N06 Datasheet(HTML) 2 Page - Fairchild Semiconductor

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©2002 Fairchild Semiconductor Corporation
RFG45N06, RFP45N06, RF1S45N06SM Rev. B
Absolute Maximum Ratings TC = 25oC, Unless Otherwise Specified
RFG45N06, RFP45N06
RF1S45N06SM
UNITS
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS
60
V
Drain to Gate Voltage (RG = 20KΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR
60
V
Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM
45
Refer to Peak Current Curve
A
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS
±20
V
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EAS
Refer to UIS Curve
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD
Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
131
0.877
W
W/oC
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG
-55 to 175
oC
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tpkg
300
260
oC
oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. TJ = 25
oC to 150oC.
Electrical Specifications
TC = 25
oC, Unless Otherwise Specified
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Drain to Source Breakdown Voltage
BVDSS
ID = 250µA, VGS = 0V (Figure 11)
60
-
-
V
Gate Threshold Voltage
VGS(TH)
VGS = VDS, ID = 250µA (Figure 10)
2
-
4
V
Zero Gate Voltage Drain Current
IDSS
VDS = Rated BVDSS, VGS = 0V
-
-
1
µA
VDS = 0.8 x Rated BVDSS, VGS = 0V (125
oC)
-
-
25
µA
Gate to Source Leakage Current
IGSS
VGS = ±20V
-
-
±100
nA
Drain Source On Resistance (Note 2)
rDS(ON)
ID = 45A, VGS = 10V (Figure 9)
-
-
0.028
Turn-On Time
tON
VDD = 30V, ID = 45A
RL = 0.667Ω, VGS = +10V
RG = 3.6Ω (Figure 13)
-
-
120
ns
Turn-On Delay Time
td(ON)
-12-
ns
Rise Time
tr
-74-
ns
Turn-Off Delay Time
td(OFF)
-37-
ns
Fall Time
tf
-16-
ns
Turn-Off Time
tOFF
-
-
80
ns
Total Gate Charge
Qg(TOT)
VGS = 0 to 20V
VDD = 48V, ID = 45A,
RL = 1.07Ω
Ig(REF) = 1.5mA
(Figure 13)
-
125
150
nC
Gate Charge at 10V
Qg(10)
VGS = 0 to 10V
-
67
80
nC
Threshold Gate Charge
Qg(TH)
VGS = 0 to 2V
-
3.7
4.5
nC
Input Capacitance
CISS
VDS = 25V, VGS = 0V
f = 1MHz (Figure 12)
-
2050
-
pF
Output Capacitance
COSS
-
600
-
pF
Reverse Transfer Capacitance
CRSS
-
200
-
pF
Thermal Resistance Junction to Case
RθJC
-
-
1.14
oC/W
Thermal Resistance Junction to Ambient
RθJA
--
80
oC/W
Source to Drain Diode Specifications
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Source to Drain Diode Voltage
VSD
ISD = 45A
-
-
1.5
V
Diode Reverse Recovery Time
trr
ISD = 45A, dISD/dt = 100A/µs
-
-
125
ns
NOTES:
2. Pulse test: pulse width
≤ 300µs, duty cycle ≤ 2%.
3. Repetitive rating: pulse width limited by maximum junction temperature. See Transient Thermal Impedance curve (Figure 3) and Peak Current
Capability Curve (Figure 5).
RFG45N06, RFP45N06, RF1S45N06SM


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