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HSMS-2822-TR1G Datasheet(PDF) 2 Page - AVAGO TECHNOLOGIES LIMITED

Part # HSMS-2822-TR1G
Description  Surface Mount RF Schottky Barrier
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Manufacturer  AVAGO [AVAGO TECHNOLOGIES LIMITED]
Direct Link  http://www.avagotech.com
Logo AVAGO - AVAGO TECHNOLOGIES LIMITED

HSMS-2822-TR1G Datasheet(HTML) 2 Page - AVAGO TECHNOLOGIES LIMITED

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Electrical Specifications T
C = 25°C, Single Diode
[3]
Maximum Maximum
Minimum
Maximum Forward
Reverse
Typical
Part
Package
Breakdown
Forward
Voltage
Leakage
Maximum
Dynamic
Number Marking Lead
Voltage
Voltage
V
F (V) @
I
R (nA) @
Capacitance Resistance
HSMS[4]
Code
Code Configuration
V
BR (V)
V
F (mV)
I
F (mA)
V
R (V)
C
T (pF)
R
D (Ω)
[5]
2820
C0
0
Single
15
340
0.5
10
100
1
1.0
12
2822
C2
2
Series
2823
C3
3
Common Anode
2824
C4
4
Common Cathode
2825
C5
5
Unconnected Pair
2827
C7
7
Ring Quad[4]
2828
C8
8
Bridge Quad[4]
2829
C9
9
Cross‑over Quad
282B
C0
B
Single
282C
C2
C
Series
282E
C3
E
Common Anode
282F
C4
F
Common Cathode
282K
CK
K
High Isolation
Unconnected Pair
282L
CL
L
Unconnected Trio
282M
HH
M
Common Cathode Quad
282N
NN
N
Common Anode Quad
282P
CP
P
Bridge Quad
282R
OO
R
Ring Quad
Test Conditions
I
R = 100 mA
I
F = 1 mA
[1]
V
R = 0V
[2]
I
F = 5 mA
f = 1 MHz
Notes:
1. ∆V
F for diodes in pairs and quads in 15 mV maximum at 1 mA.
2. ∆C
TO for diodes in pairs and quads is 0.2 pF maximum.
3. Effective Carrier Lifetime (τ) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA.
4. See section titled “Quad Capacitance.”
5. R
D = RS + 5.2Ω at 25°C and If = 5 mA.
Notes:
1. Package marking provides orientation and identification.
2. See “Electrical Specifications” for appropriate package marking.
Pin Connections and Package Marking
Symbol
Parameter
Unit
SOT-23/SOT-143
SOT-323/SOT-363
I
f
Forward Current (1 μs Pulse)
Amp
1
1
P
IV
Peak Inverse Voltage
V
15
15
T
j
Junction Temperature
°C
150
150
T
stg
Storage Temperature
°C
‑65 to 150
‑65 to 150
θ
jc
Thermal Resistance[2]
°C/W
500
150
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
2. T
C = +25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board.
Absolute Maximum Ratings[1] T
C = 25°C
1
2
3
6
5
4


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