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TV605-019.2M Datasheet(PDF) 4 Page - Connor-Winfield Corporation |
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TV605-019.2M Datasheet(HTML) 4 Page - Connor-Winfield Corporation |
4 / 4 page Table 13.0 Package Ceramic Surface Mount Package. 2111 Comprehensive Drive Aurora, Illinois 60505 Phone: 630-851-4722 Fax: 630-851-5040 www.conwin.com 120°C 150°C 180°C 260°C 0 220°C 360 Sec. Max. 120 S Max. 10 S 60 S Max. Time Temperature 260°C 90% 50% 10% 200 mV/Div 0 Design Recommendations OSC TOP LAYER GROUND LAYER BOTTOM LAYER Output Buffer 50 Ohm Trace Without Vias Model TV504-019.2MHz Typical Phase Noise Solder Profile LVCMOS Output Waveform Clipped Sinewave Output Waveform Package Characteristics Environmental Characteristics Table 14.0 Vibration: Vibration per Mil Std 883E Method 2007.3 Test Condition A Shock: Mechanical Shock per Mil Std 883E Method 2002.4 Test Condition B. Soldering: SMD product suitable for Convection Reflow soldering. Peak temperature 260 C. Maximum time above 220 C, 60 seconds. Solderability Solderability per Mil Std 883E Method 2003 Suggested Pad Layout Buffer Ground 50 Ohm trace <1”by design Vcc Ground Top View Specifications subject to change without notice. All dimensions in inches. © Copyright 2008 The Connor-Winfield Corporation US Headquarters: 630-851-4722 European Headquarters: +353-61-472221 Bulletin Page Revision Date Tx215 4of4 01 25 Aug 2008 (Top View) 1 2 3 4 0.69 (17.53mm) 0.08 (2.0mm) 0.08 (2.0mm) 3.15 (80mm) 9.84 (250mm) 0.08 (2.0mm) 8.45 Dia. (214.6mm) 1.0 Dia. (25.4mm) 4-PAD Ceramic Package 0.197x0.295 (5.0x7.0mm) Standard Orientation Tape and Reel Specifications Meets EIA-481A and EIJ-1009B 2000 Pieces/Reel Maximum. Direction of Feed (Customer) 0.157 (4mm) 0.079 (2mm) 0.020 R. (0.5mm) 0.63 (1.6mm) Dia. 0.059 (1.5mm) Dia. 0.069 (1.75mm) 0.295 (7.5mm) 0.642 (16.30mm) 0.626 (15.90mm) 0.059 (1.5mm) Dia. Minimum Pocket Size (Ao) (Bo) (Ko) 5.33mm (0.21”) 7.87mm (0.31”) 3.07mm (0.121”) 16mm (0.630”) Width 8mm (0.315”) Pitch 3° Typical 0.210 (5.33mm) (Ao) 0.121 (3.07mm) (Ko) 0.315 (8.0mm) 3° Typical 0.31 (7.87mm) (Bo) 0.014 (+/-.004) (0.36mm +/-.01) SM-MECH09 0.010”(0.254mm) Recommended clearance inductance for internal copper flood. 1 3 4 5 6 8 9 10 4 1 2 3 Vcc, should have a large copper area for reduced inductance. Connect a 0.01uF bypass capacitor <0.1”(2.54mm) from the pad. Ground, should have a large copper area for reduced inductance. Top View |
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