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MBT801-S Datasheet(PDF) 9 Page - Seoul Semiconductor |
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MBT801-S Datasheet(HTML) 9 Page - Seoul Semiconductor |
9 / 11 page Rev. 00 Rev. 00 November 2007 November 2007 www.ZLED.com www.ZLED.com 7. soldering 10 sec. Max. Soldering time Condition 240℃ Max. Peak-Temperature 120 sec. Max. Pre-heat time 120~150℃ Pre-heat Lead Solder 10 sec. Max. Soldering time Condition 260℃ Max. Peak-Temperature 120 sec. Max. Pre-heat time 150~200℃ Pre-heat Lead Free Solder 260 C Max. 10 sec. Max. o 60sec. Max. Above 220 C 120sec. Max. Pre-heating 150~200 C 1~5 C / sec. o o o o 1~5 C / sec. Lead Solder 2.5~5 C / sec. o o o Pre-heating 120~150 C 120sec. Max. 60sec. Max. Above 200 C o 240 C Max. 10 sec. Max. 2.5~5 C / sec. (1) Lead Solder (2) Lead-Free Solder Lead-frame Solder (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. |
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