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SWBF07 Datasheet(PDF) 11 Page - Seoul Semiconductor |
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SWBF07 Datasheet(HTML) 11 Page - Seoul Semiconductor |
11 / 15 page -7-03-44(갑) Rev. 1.00 SWBF07 9. Soldering Profile The LED can be soldered in place using the reflow soldering method. (1) Lead solder Preliminary heating to be at maximum 210°C for maximum 2 minutes. Soldering heat to be at maximum 240°C for maximum 10 seconds. 0 15 30 45 60 75 90 105 120 135 150 165 180 195 0 40 80 120 160 200 240 280 Soldering Times [sec] (2) Lead-free solder Preliminary heating to be at maximum 220°C for maximum 2 minutes. Soldering heat to be at maximum 260°C for maximum 10 seconds. 0 15 30 45 60 75 90 105 120 135 150 165 180 195 0 40 80 120 160 200 240 280 Soldering Times [sec] (3) Hand Soldering conditions Not more than 5 seconds @MAX 300°C, under Soldering iron. SEOUL SEMICONDUCTOR CO., LTD. 10 SSC-QP |
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