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UHPT801 Datasheet(PDF) 9 Page - Seoul Semiconductor |
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UHPT801 Datasheet(HTML) 9 Page - Seoul Semiconductor |
9 / 10 page Rev. 00 Rev. 00 November 2007 November 2007 www.ZLED.com www.ZLED.com 서식번호 : SSC-QP-7-07-24 (Rev.00) 7. soldering 10 sec. Max. Soldering time Condition 240℃ Max. Peak-Temperature 120 sec. Max. Pre-heat time 120~150℃ Pre-heat Lead Solder 10 sec. Max. Soldering time Condition 260℃ Max. Peak-Temperature 120 sec. Max. Pre-heat time 150~200℃ Pre-heat Lead Free Solder 260 C Max. 10 sec. Max. o 60sec. Max. Above 220 C 120sec. Max. Pre-heating 150~200 C 1~5 C / sec. o o o o 1~5 C / sec. Lead Solder 2.5~5 C / sec. o o o Pre-heating 120~150 C 120sec. Max. 60sec. Max. Above 200 C o 240 C Max. 10 sec. Max. 2.5~5 C / sec. (1) Lead Solder (2) Lead-Free Solder Lead-frame Solder (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. |
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