IN74HC174A datasheet(2/6 Pages) IKSEMICON

Part #	IN74HC174A

Description	Hex D Flip-Flop with Common Clock and Reset High-Performance Silicon-Gate CMOS

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Manufacturer	IKSEMICON [IK Semicon Co., Ltd]

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IN74HC174A

MAXIMUM RATINGS

*

Symbol

Parameter

Value

Unit

VCC

DC Supply Voltage (Referenced to GND)

-0.5 to +7.0

V

VIN

DC Input Voltage (Referenced to GND)

-1.5 to VCC +1.5

V

VOUT

DC Output Voltage (Referenced to GND)

-0.5 to VCC +0.5

V

IIN

DC Input Current, per Pin

±20

mA

IOUT

DC Output Current, per Pin

±25

mA

ICC

DC Supply Current, VCC and GND Pins

±50

mA

PD

Power Dissipation in Still Air, Plastic DIP+

SOIC Package+

750

500

mW

Tstg

Storage Temperature

-65 to +150

°C

TL

Lead Temperature, 1,5 mm from Case for 4 Seconds

(Plastic DIP or SOIC Package)

260

°C

*Maximum Ratings are those values beyond which damage to the device may occur.

Functional operation should be restricted to the Recommended Operating Conditions.

+Derating - Plastic DIP: - 10 mW/

°C from 65° to 125°C

SOIC Package: : - 7 mW/

°C from 65° to 125°C

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min

Max

Unit

VCC

DC Supply Voltage (Referenced to GND)

2.0

6.0

V

VIN, VOUT

DC Input Voltage, Output Voltage (Referenced to GND)

0

VCC

V

TA

Operating Temperature, All Package Types

-55

+125

°C

tr, tf

Input Rise and Fall Time

(Figure 1)

VCC =2.0 V

VCC =4.5 V

VCC =6.0 V

0

1000

500

400

ns

This device contains protection circuitry to guard against damage due to high static voltages or electric fields.

However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this

high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or

VOUT)≤VCC.

Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused

outputs must be left open.

Rev. 00

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IN74HC174A Datasheet(PDF) 2 Page - IK Semicon Co., Ltd

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