IL2595-xx

Characteristic

Symbol

Test Condition

Min

Typ

Max

Unit

Thermal Resistance

TO-220 or TO-263 Package

Junction to Case

2

°C/W

TO-220 Package Junction to

Ambient (Note 4)

50

°C/W

TO-263 Package Junction to

Ambient (Note 5)

50

°C/W

TO-263 Package Junction to

Ambient (Note 6)

30

°C/W

TO-263 Package Junction to

Ambient (Note 7)

20

°C/W

Note 1

: No elements connected to output pin.

Note 2

: Feedback pin removed from output and connected to 0V to force the output transistor switch ON.

Note 3

: Feedback pin removed from output and connected to 12V for the 3.3V, 5V, and the A version, and 15V for the

12V version. To force the output transistor switch OFF.

Note 4

: Junction to ambient thermal resistance (no external heat sink) for the TO-220 package mounted vertically, with

the leads soldered to a printed circuit board with (1 oz.) copper area of approximately 1 in

Note 5

: Junction to ambient thermal resistance with the TO-263 package tab soldered to a single printed circuit board

with 0.5 in

Note 6

: Junction to ambient thermal resistance with the TO-263 package tab soldered to a single sided printed circuit

board with 2.5 in

Note 7

: Junction to ambient thermal resistance with the TO-263 package tab soldered to a double sided printed circuit

board with 3 in

the other side of the p-c board.

4

Rev. 00