11

LTC1470/LTC1471

14701fa

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of circuits as described herein will not infringe on existing patent rights.

S Package

16-Lead Plastic Small Outline (Narrow .150 Inch)

(Reference LTC DWG # 05-08-1610)

S8 Package

8-Lead Plastic Small Outline (Narrow .150 Inch)

(Reference LTC DWG # 05-08-1610)

.016 – .050

(0.406 – 1.270)

.010 – .020

(0.254 – 0.508)

× 45°

0

°– 8° TYP

.008 – .010

(0.203 – 0.254)

SO8 0303

.053 – .069

(1.346 – 1.752)

.014 – .019

(0.355 – 0.483)

TYP

.004 – .010

(0.101 – 0.254)

.050

(1.270)

BSC

1

2

3

4

.150 – .157

(3.810 – 3.988)

NOTE 3

8

7

6

5

.189 – .197

(4.801 – 5.004)

NOTE 3

.228 – .244

(5.791 – 6.197)

.245

MIN

.160

±.005

RECOMMENDED SOLDER PAD LAYOUT

.045

±.005

.050 BSC

.030

±.005

TYP

INCHES

(MILLIMETERS)

NOTE:

1. DIMENSIONS IN

2. DRAWING NOT TO SCALE

3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)

.016 – .050

(0.406 – 1.270)

.010 – .020

(0.254 – 0.508)

× 45°

0

° – 8° TYP

.008 – .010

(0.203 – 0.254)

1

N

2

3

4

5

6

7

8

N/2

.150 – .157

(3.810 – 3.988)

NOTE 3

16

15

14

13

.386 – .394

(9.804 – 10.008)

NOTE 3

.228 – .244

(5.791 – 6.197)

12

11

10

9

S16 0502

.053 – .069

(1.346 – 1.752)

.014 – .019

(0.355 – 0.483)

TYP

.004 – .010

(0.101 – 0.254)

.050

(1.270)

BSC

.245

MIN

N

12

3

N/2

.160

±.005

RECOMMENDED SOLDER PAD LAYOUT

.045

±.005

.050 BSC

.030

±.005

TYP

INCHES

(MILLIMETERS)

NOTE:

1. DIMENSIONS IN

2. DRAWING NOT TO SCALE

3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)