LTC3525L-3

11

3525lf

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTIO

SC6 Package

6-Lead Plastic SC70

(Reference LTC DWG # 05-08-1638 Rev B)

1.15 – 1.35

(NOTE 4)

1.80 – 2.40

0.15 – 0.30

6 PLCS (NOTE 3)

SC6 SC70 1205 REV B

1.80 – 2.20

(NOTE 4)

0.65 BSC

PIN 1

0.80 – 1.00

1.00 MAX

0.00 – 0.10

REF

NOTE:

1. DIMENSIONS ARE IN MILLIMETERS

2. DRAWING NOT TO SCALE

3. DIMENSIONS ARE INCLUSIVE OF PLATING

4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR

5. MOLD FLASH SHALL NOT EXCEED 0.254mm

6. DETAILS OF THE PIN 1 IDENTIFIER ARE OPTIONAL,

BUT MUST BE LOCATED WITHIN THE INDEX AREA

7. EIAJ PACKAGE REFERENCE IS EIAJ SC-70

8. JEDEC PACKAGE REFERENCE IS MO-203 VARIATION AB

2.8 BSC

0.47

MAX

0.65

REF

RECOMMENDED SOLDER PAD LAYOUT

PER IPC CALCULATOR

1.8 REF

1.00 REF

INDEX AREA

(NOTE 6)

0.10 – 0.18

(NOTE 3)

0.26 – 0.46

GAUGE PLANE

0.15 BSC

0.10 – 0.40