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FBA1J4BTTE300P Datasheet(PDF) 8 Page - KOA Speer Electronics, Inc. |
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FBA1J4BTTE300P Datasheet(HTML) 8 Page - KOA Speer Electronics, Inc. |
8 / 8 page KOA SPEER ELECTRONICS, INC. SS-224 R5 Bolivar Drive I P.O. Box 547 I Bradford, PA 16701 I USA I 814-362-5536 I Fax 814-362-8883 I www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. PAGE 8 OF 8 10. Recommended PC Board Land Patterns - inches (mm) Chip Component Size Size LW AB C E 1206 .126 .063 .030 .120 .016 .031 (3216) (3.2) (1.6) (0.762) (3.048) (0.406) (0.787) Soldering Pad Chip Component L C E BW A Item Requirement Conditions Thermal Shock Appearance: There shall be no physical or Step Temperature Time mechanical damage. 1-start -40°C ±2°C — Impedance: Relative to initial value ±20%. 2-hold -40°C ±2°C 30 min ±5 min DCR: The DCR shall not exceed initial specified 3-transfer — 0.5 min max. value. 4-hold +105°C ±2°C 30 min ±5 min 5-transfer — 0.5 min max. Testing of the parts will be made at 0 hours, 250 hours and 500 hours. Before testing the parts Steps 1 thru 5 constitute one complete cycle shall be allowed to cool to room temperature for and the test shall consist of a total of 500 24 hours. cycles. Load Humidity Appearance: There shall be no physical or Temperature: 85°C ±2°C mechanical damage Relative Humidity: 85% Impedance: Relative to initial value ±15% Time: 1,000 hours total Apply: 100% rated current Measurements shall be taken at 0 hours, 250 hours, 500 hours and 1,000 hours and shall meet the conditions stated above. Life Test Appearance: There shall be no physical or Temperature: 85°C ±2°C mechanical damage Time: 1,000 hours total Impedance: Relative to initial value ±15% Apply: 100% rated current Measurements shall be taken at 0 hours, 250 hours, 500 hours and 1,000 hours and shall meet the conditions stated above. 9. Characteristics (continued) |
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