KOA SPEER ELECTRONICS, INC.

TN-200 R7

Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.

PAGE 9 OF 9

9. Recommended Washing Condition

Isopropyl alcohol and methyl alcohol used for the

washing process will not affect the part performance.

Ultrasonic cleaning should be changed to condition

for size of printed wiring board and type of oscillator.

Overpowering of ultrasonic cleaning will cause

problems according to resonant

phenomenon. Condition of ultrasonic cleaner should

be confirmed prior to use.

We recommend the following conditions:

Ultrasonic power:

Within 20W/1

Cleaning times:

Within 5 minutes

(2) Reel dimensions

.079

(2

± 0.5)

Marking

place

.511

(13

± 0.5)

.448 (11.4

± 1.5)

2.36

(60

± 2.0)

7.00

(178

± 2.0)

.393 (10

± 1.5)

(Marking item)

(1) Type designation

(2) Nominal inductance

(3) Quantity

(4) Production lot number

(5) Manufacturer's name

Dimensions in inches (mm)

8. Recommended Soldering Condition

8-1 Dimensions of Standard Land

Size

A

B

C

0402 - 1E

.016 ~ .020

.012 ~ .020

.016 ~ .020

(0.4 ~ 0.5)

(0.3 ~ 0.5)

(0.4 ~ 0.5)

0603 - 1J

.031 ~ .039

.016 ~ .031

.016 ~ .031

(0.8 ~ 1.0)

(0.4 ~ 0.8)

(0.4 ~ 0.8)

0805 - 2A

.047 ~ .055

.035 ~ .051

.016 ~ .031

(1.2 ~ 1.4)

(0.9 ~ 1.3)

(0.4 ~ 0.8)

1206 - 2B

.079 ~ .094

.047 ~ .063

.016 ~ .031

(2.0 ~ 2.4)

(1.2 ~ 1.6)

(0.4 ~ 0.8)

Dimensions in inches (mm)

A

C

B

Chip coil

Land

Solder resist

8-2 Soldering Condition

Reflow soldering should be done at 240°C within

20 seconds. Flow soldering should be done at 260°C

within 10 seconds. Please use suitable solder quantity,

too much solder may affect performance of product.

Solder

Solder

Empty

Top tape

5.90 (150

± )

20

0

13.76 (350

± )

20

0

4,000 pieces

11.80 (300

± )

20

0

Empty

Tape running direction

10. Storage

Chip inductors should not be stored under

high temperature and high humidity conditions.

In particular, do not store taping where it is

exposed to heat or direct sunlight. Otherwise,

the packing material may be deformed,

causing problems during mounting.