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KL732BTTE18N Datasheet(PDF) 7 Page - KOA Speer Electronics, Inc. |
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KL732BTTE18N Datasheet(HTML) 7 Page - KOA Speer Electronics, Inc. |
7 / 7 page Bolivar Drive I P.O. Box 547 I Bradford, PA 16701 I USA I 814-362-5536 I Fax 814-362-8883 I www.koaspeer.com Specifications given herein may be changed at any time without pr ior notice. Please confir m technical specifications before you order and/or use. PAGE 7 OF 7 SS-211 R5 9. Recommended Washing Condition Isopropyl alcohol and methyl alcohol used for the washing process will not affect the part performance. Ultrasonic cleaning should be changed to condition for size of printed wiring board and type of oscillator. Overpowering of ultrasonic cleaning will cause problems according to resonant phenomenon. Condition of ultrasonic cleaner should be confirmed prior to use. We recommend the following conditions: Ultrasonic power: Within 20W/1 Cleaning times: Within 5 minutes 10. Storage Chip inductors should not be stored under high temperature and high humidity conditions. In particular, do not store taping where it is exposed to heat or direct sunlight. Otherwise, the packing material may be deformed, causing problems during mounting. (2) Reel dimensions .079 (2 ± 0.5) Marking place .511 (13 ± 0.5) .448 (11.4 ± 1.5) 2.36 (60 ± 2.0) 7.00 (178 ± 2.0) .393 (10 ± 1.5) (Marking item) (1) Type designation (2) Nominal inductance (3) Quantity (4) Production lot number (5) Manufacturer's name Dimensions in inches (mm) 8. Recommended Soldering Condition 8-1 Dimensions of Standard Land Size A B C 2B .079 ~ .094 .047 ~ .063 .016 ~ .031 (2.0 ~ 2.4) (1.2 ~ 1.6) (0.4 ~ 0.8) Dimensions in inches (mm) A C B Chip coil Land Solder resist 8-2 Soldering Condition Reflow soldering should be done at 240°C within 20 seconds. Flow soldering should be done at 260°C within 10 seconds. Please use suitable solder quantity, too much solder may affect performance of product. Solder Solder KOA SPEER ELECTRONICS, INC. |
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