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KGM1206HCTTE1012A Datasheet(PDF) 5 Page - KOA Speer Electronics, Inc. |
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KGM1206HCTTE1012A Datasheet(HTML) 5 Page - KOA Speer Electronics, Inc. |
5 / 8 page Bolivar Drive I P.O. Box 547 I Bradford, PA 16701 I USA I 814-362-5536 I Fax 814-362-8883 I www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. PAGE 5 OF 8 SS-227 R2 KOA SPEER ELECTRONICS, INC. Item Requirement Conditions Terminal Adhesion No physical damage Solder a chip to a test Strength substrate and then laterally apply a load (5N, 500gF) in the arrow direction. Soldering Heat Appearance: No physical damage Flux: 25% rosin Resistance Capacitance: Within tolerance Pre-heating: 60 sec Dielectric Loss: Within tolerance Pre-heating Temp: 150°C Insulation Resistance: Within tolerance Solder: H60A Solder Temp: 260°C ±5°C Dip Time: 5 ±0.5 sec Solderablility More than 95% of the terminal electrode shall Flux: 25% rosin be covered with new solder. Pre-heating: 60 sec Pre-heating Temp: 150°C Solder: H60A Solder Temp: 230°C ±5°C Dip Time: 4 ±1 sec Temperature Cycle Appearance: No physical damage Repeat the following heat cycle 10 times: Capacitance: Within tolerance Step Temperature Time Dielectric Loss: Within tolerance 1 -40°C ±3°C 30 min ±3 min Insulation Resistance: Within tolerance 2 Room Temp. 15 min max. 3 85°C ±2°C 30 min ±3 min 4 Room Temp. 15 min max. High Temperature Appearance: No physical damage Temp: 70°C ±2°C Resistance Capacitance: Within tolerance Bias: 150% of rated voltage Dielectric Loss: Within tolerance Test Time: 1000+48/-0 hour Insulation Resistance: Within tolerance Humidity Resistance Appearance: No physical damage Temp: 85°C ±2°C (unload) Capacitance: Within tolerance Humidity: 85% ±5% Dielectric Loss: Within tolerance Test Time: 500+24/-0 hour Insulation Resistance: Within tolerance Vending Substrate Appearance: No physical damage After soldering a chip to a test substrate, Capacitance: Within tolerance bend the substrate by 1 mm and then measure. The substrate is GE4 or based on GE4. 8. Characteristics Cont. Substrate Chip Weight 20 Displacement Substrate 45 ± 2 45 ± 2 |
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