Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.

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SS-227 R2

KOA SPEER ELECTRONICS, INC.

Item

Requirement

Conditions

Terminal Adhesion

No physical damage

Solder a chip to a test

Strength

substrate and then

laterally apply a

load (5N, 500gF) in

the arrow direction.

Soldering Heat

Appearance: No physical damage

Flux: 25% rosin

Resistance

Capacitance: Within tolerance

Pre-heating: 60 sec

Dielectric Loss: Within tolerance

Pre-heating Temp: 150°C

Insulation Resistance: Within tolerance

Solder: H60A

Solder Temp: 260°C ±5°C

Dip Time: 5 ±0.5 sec

Solderablility

More than 95% of the terminal electrode shall

Flux: 25% rosin

be covered with new solder.

Pre-heating: 60 sec

Pre-heating Temp: 150°C

Solder: H60A

Solder Temp: 230°C ±5°C

Dip Time: 4 ±1 sec

Temperature Cycle

Appearance: No physical damage

Repeat the following heat cycle 10 times:

Capacitance: Within tolerance

Step

Temperature

Time

Dielectric Loss: Within tolerance

1

-40°C ±3°C

30 min ±3 min

Insulation Resistance: Within tolerance

2

Room Temp.

15 min max.

3

85°C ±2°C

30 min ±3 min

4

Room Temp.

15 min max.

High Temperature

Appearance: No physical damage

Temp: 70°C ±2°C

Resistance

Capacitance: Within tolerance

Bias: 150% of rated voltage

Dielectric Loss: Within tolerance

Test Time: 1000+48/-0 hour

Insulation Resistance: Within tolerance

Humidity Resistance

Appearance: No physical damage

Temp: 85°C ±2°C

(unload)

Capacitance: Within tolerance

Humidity: 85% ±5%

Dielectric Loss: Within tolerance

Test Time: 500+24/-0 hour

Insulation Resistance: Within tolerance

Vending Substrate

Appearance: No physical damage

After soldering a chip to a test substrate,

Capacitance: Within tolerance

bend the substrate by 1 mm and then measure.

The substrate is GE4

or based on GE4.

8. Characteristics Cont.

Substrate

Chip

Weight

20

Displacement

Substrate

45

± 2

45

± 2