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KL32TTE100 Datasheet(PDF) 8 Page - KOA Speer Electronics, Inc.

Part # KL32TTE100
Description  Chip Inductors
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Manufacturer  KOA [KOA Speer Electronics, Inc.]
Direct Link  http://www.koaspeer.com
Logo KOA - KOA Speer Electronics, Inc.

KL32TTE100 Datasheet(HTML) 8 Page - KOA Speer Electronics, Inc.

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Bolivar Drive P.O. Box 547 Bradford, PA 16701 USA 814-362-5536 Fax 814-362-8883 www.koaspeer.com
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
PAGE 8 OF 8
TN-100 R3
10. Mounting
Placement force should not be excessive.
11. Recommended Washing Condition
Since this chip inductor is a coil of ultra-thin wire, it is susceptible to vibration.
If an ultrasonic cleaning unit is used for cleaning, check for any possibility of problem generation before
practical use since such cleaning units considerably differ in vibration level and mode. Although the conditions
differ depending on the printed board size, ultrasonic cleaning is generally used in the conditions described
below as examples:
Ultrasonic power:
Within 20W/1
Cleaning times:
Within 5 minutes
12. Storage
Chip inductors should not be stored under high temperature and high humidity conditions.
In particular, do not store
taping where it is exposed to heat or direct sunlight. Otherwise,
the packing material may be deformed, causing problems during mounting.
9. Recommended Soldering Condition
9-1 Dimensions of Standard Land
The following figure is recommended
land dimensions.
When two or more chip inductors are closely
mounted, they must be separated by means
of solder resists to prevent excessive solder.
Dimensions in inches (mm)
KL32
0.079
(2.0)
0.197 (5.0)
0.087 (2.2)
0.055 (1.4)
9-2 Soldering Condition
Wave soldering should be done at 260°C
for less than 10 seconds. Reflow soldering
should be done at 240°C for less than 20
seconds. (Please see the following figures.)
260
°C
150
°C
Preheat 120
Seconds Max.
Soldering
10 Seconds Max.
Natural
Cooling
Recommended Temperature Profile
for Wave Soldering
100
°C
240
°C
150
°C
Preheat 120
Seconds Max.
Soldering
20 Seconds Max.
Natural
Cooling
Recommended Temperature Profile
for Reflow Soldering
100
°C
When using a soldering iron, temperature shall
not exceed 350°C and within three seconds.
Soldering iron time shall be allowed only one
time. After soldering, chip inductors shall not
be stressed excessively.


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