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KL32TTE100 Datasheet(PDF) 8 Page - KOA Speer Electronics, Inc. |
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KL32TTE100 Datasheet(HTML) 8 Page - KOA Speer Electronics, Inc. |
8 / 8 page Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. PAGE 8 OF 8 TN-100 R3 10. Mounting Placement force should not be excessive. 11. Recommended Washing Condition Since this chip inductor is a coil of ultra-thin wire, it is susceptible to vibration. If an ultrasonic cleaning unit is used for cleaning, check for any possibility of problem generation before practical use since such cleaning units considerably differ in vibration level and mode. Although the conditions differ depending on the printed board size, ultrasonic cleaning is generally used in the conditions described below as examples: Ultrasonic power: Within 20W/1 Cleaning times: Within 5 minutes 12. Storage Chip inductors should not be stored under high temperature and high humidity conditions. In particular, do not store taping where it is exposed to heat or direct sunlight. Otherwise, the packing material may be deformed, causing problems during mounting. 9. Recommended Soldering Condition 9-1 Dimensions of Standard Land The following figure is recommended land dimensions. When two or more chip inductors are closely mounted, they must be separated by means of solder resists to prevent excessive solder. Dimensions in inches (mm) KL32 0.079 (2.0) 0.197 (5.0) 0.087 (2.2) 0.055 (1.4) 9-2 Soldering Condition Wave soldering should be done at 260°C for less than 10 seconds. Reflow soldering should be done at 240°C for less than 20 seconds. (Please see the following figures.) 260 °C 150 °C Preheat 120 Seconds Max. Soldering 10 Seconds Max. Natural Cooling Recommended Temperature Profile for Wave Soldering 100 °C 240 °C 150 °C Preheat 120 Seconds Max. Soldering 20 Seconds Max. Natural Cooling Recommended Temperature Profile for Reflow Soldering 100 °C When using a soldering iron, temperature shall not exceed 350°C and within three seconds. Soldering iron time shall be allowed only one time. After soldering, chip inductors shall not be stressed excessively. |
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