Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.

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SS-195 R6

Within 90

seconds

230

200

160

Time

Within 6

seconds

Within 30

seconds

Within 45

seconds

9. Soldering

9.1 Conditions for

Reflow Soldering

The time and temperature

for reflow solder applications

are as shown below.

4.0

± 0.2

2.6

± 0.2

3.0

± 0.2

10. Land Pattern

Design

(unit: mm)

8.5 Pattern Design

When low or more chip inductors are closely

mounted, they must be separated by means

of solder resists to prevent excessive solder.

380

7

Content marking

11. Packaging Box

(unit: mm)

KOA SPEER ELECTRONICS, INC.

8. General Information

8.1 Storage

Chip inductors shall not be stored under high

temperature and high humidity conditions.

Especially, do not store taping where they are

exposed to heat or direct sunlight, otherwise,

material may be deformed, causing problems

during mounting.

8.2 Mounting

Placement force should not be excessive.

8.3 Soldering

When using a soldering iron, temperature

shall not exceed 350°C and within 3 seconds.

Soldering iron time shall be allowed only one

time. After soldering, chip inductors shall not

be stressed excessively.

8.4 Cleaning

There is no problem using organic solvents.

Since these chip inductors are a coil of

ultra-thin wire, they are susceptible to

vibration. If an ultrasonic cleaning unit is

used, check for any possibility of problem

generation before practical use, since such

cleaning units differ considerably in vibration

level and mode. Although the conditions

vary depending on the printed board size,

Ultrasonic cleaning is generally used in

the conditions described in the following

examples:

Power:

Within 20W/L

Cleaning times: Within 5 minutes