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MX25L12845EMI-10G Datasheet(PDF) 3 Page - Macronix International

Part # MX25L12845EMI-10G
Description  128M-BIT [x 1/x 2/x 4] CMOS MXSMIO (SERIAL MULTI I/O) FLASH MEMORY
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Manufacturer  MCNIX [Macronix International]
Direct Link  http://www.macronix.com
Logo MCNIX - Macronix International

MX25L12845EMI-10G Datasheet(HTML) 3 Page - Macronix International

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MX25L12845E
P/N: PM1428
REV. 0.06, MAR. 05, 2009
(28) Write Protection Selection (WPSEL) ............................................................................................................... 31
WPSEL Flow........................................................................................................................................................... 31
(29) Single Block Lock/Unlock Protection (SBLK/SBULK) ..................................................................................... 32
Block Lock Flow...................................................................................................................................................... 32
Block Unlock Flow .................................................................................................................................................. 33
(30) Read Block Lock Status (RDBLOCK) ............................................................................................................. 34
(31) Gang Block Lock/Unlock (GBLK/GBULK)....................................................................................................... 34
(32) Clear SR Fail Flags (CLSR) ............................................................................................................................ 35
(33) Enable SO to Output RY/BY# (ESRY) ............................................................................................................ 35
(34) Disable SO to Output RY/BY# (DSRY) ........................................................................................................... 35
POWER-ON STATE ...................................................................................................................................................36
ELECTRICAL SPECIFICATIONS..............................................................................................................................37
ABSOLUTE MAXIMUM RATINGS ......................................................................................................................... 37
Figure 2. Maximum Negative Overshoot Waveform............................................................................................... 37
CAPACITANCE TA = 25°C, f = 1.0 MHz ................................................................................................................. 37
Figure 3. Maximum Positive Overshoot Waveform................................................................................................. 37
Figure 4. INPUT TEST WAVEFORMS AND MEASUREMENT LEVEL .................................................................. 38
Figure 5. OUTPUT LOADING................................................................................................................................ 38
Table 9. DC CHARACTERISTICS (Temperature = -40°C to 85°C for Industrial grade, VCC = 2.7V ~ 3.6V) ....... 39
Table 10. AC CHARACTERISTICS (Temperature = -40°C to 85°C for Industrial grade, VCC = 2.7V ~ 3.6V) ..... 40
Timing Analysis ........................................................................................................................................................42
Figure 6. Serial Input Timing................................................................................................................................... 42
Figure 7. Output Timing .......................................................................................................................................... 42
Figure 8. Serial Input Timing for Double Transfer Rate Mode ................................................................................ 43
Figure 9. Serial Output Timing for Double Transfer Rate Mode.............................................................................. 43
Figure 10. WP# Setup Timing and Hold Timing during WRSR when SRWD=1 ..................................................... 44
Figure 11. Write Enable (WREN) Sequence (Command 06).................................................................................. 44
Figure 12. Write Disable (WRDI) Sequence (Command 04) .................................................................................. 44
Figure 13. Read Identification (RDID) Sequence (Command 9F) .......................................................................... 45
Figure 14. Read Identification (RDID) Sequence (Parallel).................................................................................... 45
Figure 15. Read Status Register (RDSR) Sequence (Command 05)..................................................................... 46
Figure 16. Write Status Register (WRSR) Sequence (Command 01) ................................................................... 46
Figure 17. Read Data Bytes (READ) Sequence (Command 03)........................................................................... 47
Figure 18. Read at Higher Speed (FAST_READ) Sequence (Command 0B)....................................................... 47
Figure 19. Fast DT Read (FASTDTRD) Sequence (Command 0D) ....................................................................... 48
Figure 20. 2 x I/O Read Mode Sequence (Command BB) ..................................................................................... 48
Figure 21. Fast Dual I/O DT Read (2DTRD) Sequence (Command BD) ............................................................... 49
Figure 22. 4 x I/O Read Mode Sequence (Command EB) ..................................................................................... 49
Figure 23. Fast Quad I/O DT Read (4DTRD) Sequence (Command ED) .............................................................. 50
Figure 24. 4 x I/O Read Enhance Performance Mode Sequence (Command EB)................................................. 51
Figure 25. Fast Quad I/O DT Read (4DTRD) Enhance Performance Sequence (Command ED) ......................... 52
Figure 26. Page Program (PP) Sequence (Command 02).................................................................................... 53
Figure 27. 4 x I/O Page Program (4PP) Sequence (Command 38) ...................................................................... 53
Figure 28. Continously Program (CP) Mode Sequence with Hardware Detection (Command AD) ....................... 54
Figure 29. Sector Erase (SE) Sequence (Command 20) ...................................................................................... 54
Figure 30. Block Erase (BE) Sequence (Command D8) ....................................................................................... 54
Figure 31. Chip Erase (CE) Sequence (Command 60 or C7) ............................................................................... 55
Figure 32. Deep Power-down (DP) Sequence (Command B9)............................................................................. 55
Figure 33. Release from Deep Power-down and Read Electronic Signature (RES) Sequence (Command AB) .. 55
Figure 34. Release from Deep Power-down (RDP) Sequence (Command AB).................................................... 56
Figure 35. Read Electronic Manufacturer & Device ID (REMS) Sequence (Command 90 or EF or DF or CF) .... 56
Figure 36. READ ARRAY SEQUENCE (Parallel) .................................................................................................. 57
Figure 37. AUTO PAGE PROGRAM TIMING SEQUENCE (Parallel) ................................................................... 58


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