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EN25LF10-75GI Datasheet(PDF) 5 Page - Eon Silicon Solution Inc.

Part # EN25LF10-75GI
Description  1 Megabit Serial Flash Memory with 4Kbytes Uniform Sector
Download  30 Pages
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Manufacturer  EON [Eon Silicon Solution Inc.]
Direct Link  http://www.essi.com.tw
Logo EON - Eon Silicon Solution Inc.

EN25LF10-75GI Datasheet(HTML) 5 Page - Eon Silicon Solution Inc.

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This Data Sheet may be revised by subsequent versions
©2004 Eon Silicon Solution, Inc., www.essi.com.tw
or modifications due to changes in technical specifications.
5
EN25LF10
Rev. B, Issue Date: 2008/06/23
OPERATING FEATURES
SPI Modes
The EN25LF10 is accessed through an SPI compatible bus consisting of four signals: Serial Clock
(CLK), Chip Select (CS#), Serial Data Input (DI) and Serial Data Output (DO). Both SPI bus
operation Modes 0 (0,0) and 3 (1,1) are supported. The primary difference between Mode 0 and
Mode 3, as shown in Figure 3, concerns the normal state of the CLK signal when the SPI bus
master is in standby and data is not being transferred to the Serial Flash. For Mode 0 the CLK signal
is normally low. For Mode 3 the CLK signal is normally high. In either case data input on the DI pin is
sampled on the rising edge of the CLK. Data output on the DO pin is clocked out on the falling edge
of CLK.
Figure 3. SPI Modes
Page Programming
To program one data byte, two instructions are required: Write Enable (WREN), which is one byte,
and a Page Program (PP) sequence, which consists of four bytes plus data. This is followed by the
internal Program cycle (of duration tPP).
To spread this overhead, the Page Program (PP) instruction allows up to 256 bytes to be pro-
grammed at a time (changing bits from 1 to 0), provided that they lie in consecutive addresses on
the same page of memory.
Sector Erase, Block Erase and Chip Erase
The Page Program (PP) instruction allows bits to be reset from 1 to 0. Before this can be applied,
the bytes of memory need to have been erased to all 1s (FFh). This can be achieved a sector at a
time, using the Sector Erase (SE) instruction, a block at a time using the Block Erase (BE)
instruction or throughout the entire memory, using the Chip Erase (CE) instruction. This starts an
internal Erase cycle (of duration tSE tBE or tCE). The Erase instruction must be preceded by a Write
Enable (WREN) instruction.
Polling During a Write, Program or Erase Cycle
A further improvement in the time to Write Status Register (WRSR), Program (PP) or Erase (SE, BE
or CE ) can be achieved by not waiting for the worst case delay (tW, tPP, tSE, tBE or tCE). The
Write In Progress (WIP) bit is provided in the Status Register so that the application program can
monitor its value, polling it to establish when the previous Write cycle, Program cycle or Erase cycle
is complete.
Active Power, Stand-by Power and Deep Power-Down Modes
When Chip Select (CS#) is Low, the device is enabled, and in the Active Power mode. When Chip
Select (CS#) is High, the device is disabled, but could remain in the Active Power mode until all
internal cycles have completed (Program, Erase, Write Status Register). The device then goes into
the Stand-by Power mode. The device consumption drops to ICC1.
The Deep Power-down mode is entered when the specific instruction (the Enter Deep Power-down
Mode (DP) instruction) is executed. The device consumption drops further to ICC2. The device re-


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