SMJ320C30KGDB

FLOATING-POINT DIGITAL SIGNAL PROCESSOR

KNOWN GOOD DIE

SGUS019B – NOVEMBER 1995 – REVISED DECEMBER 1998

2

POST OFFICE BOX 1443

High-level language support is easily implemented through a register-based architecture, large address space,

powerful addressing modes, flexible instruction set, and well-supported floating-point arithmetic.

known good die (KGD) technology

KGD options are available for use in multichip modules and chip-on-board (COB) applications. The current

verification technology that supports KGD requirements for the SMJ320C30KGDB is a hot chuck probe

process. This process uses standard probed product that is tested in wafer form at speed and elevated

temperature to full data sheet specifications. Each individual die is then sawed, inspected, and packaged for

shipment.

electrical specifications

For electrical and timing specifications, see the

SMJ320C30 Digital Signal Processor data sheet, literature

number SGUS014.

SMJ

320

C

30

KGD

M

40

PREFIX

SMJ =

MIL-PRF-38535

DEVICE FAMILY

320 = DSP Family

TECHNOLOGY

C = CMOS

DEVICE

30 = Floating-Point DSP

SPEED RANGE

40 = 40 MHz

50 = 50 MHz

PACKAGE TYPE

KGD = Known Good Die

TEMPERATURE RANGE

M = – 55

°C to125°C

L=

0

°Cto 70°C

B

DIE REVISION

’C30

B

= Revision 7.4

Figure 1. SMJ320C30KGDB Device Nomenclature