PRELIMINARY DATA SHEET • SKY77176

AUTOSMART™ DUAL-BAND POWER AMPLIFIER MODULE

FOR CDMA/PCS (824–849 MHZ AND 1850–1910 MHZ)

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

8

November 17, 2007 • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • 200409A

PIN 1 INDICATOR

4X 0.44

0.25 TYP

2X 0.68

Package

Outline

Package

Outline

Package

Outline

A

2X 2.18

2X 2.33

3.3

1.35

C

C

8X 0.58

12X 0.83

3.4

SOLDER MASK OPENING

TOP VIEW

0.25 TYP

B

12X 0.73

METALLIZATION

TOP VIEW

STENCIL APERTURE

TOP VIEW

Stencil aperture size for Center Ground Pad should be 80%-100%

(by area) of the Solder Mask Opening package.

A

A

8X 0.48

0

2X 0.45

A

2X 2.18

2X 1.32

2X 0.08

2X 0.35

2X 1.49

12X 0.73

0

2X 0.45

4X 0.54

C

0.2 TYP

2X 2.18

C

2X 1.32

2X 0.35

2X 1.49

2X 2.18

4.65

3.3

B

2.18

2X 1.49

2X 0.35

0.6

1.32

2X 2.18

B

0.3

0.6

3X 0.44

2X 0.45

0

7X 0.48

Thermal Via Array Ø0.3 mm on 0.6 mm Pitch

Additional vias will improve thermal performance.

NOTE: Thermal Vias should be tented and filled with

solder mask 30–35 μm Cu plating recommended

200409_005

Common Ground Pad represents the merger of the

module Center Ground Pad and two individual I/O Ground pads.

Therefore the number of places dimensioned is reduced.

All dimensions are in millimeters.

Figure 5. Phone PCB Layout Footprint for 3 x 5, 12-Pad Package – SKY77176