Micrel, Inc.

SY56016R

December 2008

3

M9999-121708-A

Source or sink current on VT pin .................. ±100mA

Input Current

Source or sink current on (IN, /IN) .................. ±50mA

Maximum operating Junction Temperature.............125°C

Lead Temperature (soldering, 20sec.) ....................260°C

Package Thermal Resistance

(3)

MLF

®

Still-air (

Junction-to-board (

Symbol

Parameter

Condition

Min

Typ

Max

Units

Power Supply Voltage Range

2.375

1.14

1.7

2.375

2.5

1.2

1.8

2.5

2.625

1.26

1.9

2.625

V

V

V

V

Power Supply Current

30

42

mA

Power Supply Current

16

21

mA

Input Resistance

45

50

55

Ω

Differential Input Resistance

(IN-to-/IN)

90

100

110

Ω

Input HIGH Voltage

(IN, /IN)

1.42

V

Input LOW Voltage

(5)

(IN, /IN)

1.22V = 1.7V-0.475V

1.22

V

Input Voltage Swing

(IN, /IN)

See Figure 3a, applied to input of transmission

line.

0.2

1.0

V

Differential Input Voltage Swing

(|IN - /IN|)

See Figure 3b, applied to input of transmission

line.

0.4

2.0

V

1.28

V

Notes:

1. Exceeding the absolute maximum rating may damage the device.

2. The device is not guaranteed to function outside its operating rating.

3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB.

are determined for a 4-layer board in still-air number, unless otherwise stated.

4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.