SPECIFICATIONS, ALL MODELS

Specifications are at T

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

INPUT

Voltage Range

4.5

5

5.5

VDC

10.8

12

13.2

VDC

13.5

15

16.5

VDC

21.6

24

26.4

VDC

OUTPUT

Rated Power

750

mW

Voltage Setpoint Accuracy

Rated Load, Nominal V

IN

±5

%

Ripple & Noise

BW = DC to 10MHz

150

200

mVp-p

BW =10Hz to 2MHz

30

40

mVrms

Voltage (Over Input Voltage Range) 1mA to Rated Current, V

4.75

7

VDC

1mA to Rated Current, V

11.40

15

VDC

1mA to Rated Current, V

14.25

18

VDC

Temperature Coefficent

.01

.05

%/°C

REGULATION

Load Regulation (All other modes)

Rated Load to 1mA Load

3

%

GENERAL

ISOLATION

Rated Voltage

1000

VDC

Test Voltage

60 Hz, 60 Seconds

3000

Vpk

Resistance

10

G

Ω

Capacitance

25

100

pF

Leakage Current

V

2

7

μArms

Switching Frequency

170

kHz

Frequency Change

Over Line and Load

24

%

Package Weight

3

g

MTTF per MIL-HDBK-217, Rev. F*

Circuit Stress Method

Ground Benign

T

7.9

MHr

Moisture Sensitivity Level (MSL)

IPC/JEDEC J-STD-20

2

TEMPERATURE

Specification

-25

+25

+85

°C

Operation

-40

+100

°C

Storage

-40

+110

°C

The HPR4XXC devices are intended for wave soldering or manual soldering.

They are not intended to be subject to surface mount processes under any circumstances.

The normal wave soldering process can be used with these devices where the device is subjected

to a maximum wave temperature of 260°C for a period of no more than 10 seconds. Within this

time and temperature range, the integrity of the device’s plastic body will not be compromised and

internal temperatures within the converter will not exceed 175°C. Care should be taken to control

manual soldering limits identical to that of wave soldering.

SOLDERING INFORMATION

HPR4xxC_B01 Page 2 of 4

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HPR4XXC

0.75 Watt Miniature SIP DC/DC Converter

HPR4XXC.B01 Page 2 of 4