MDS751 datasheet(1/1 Pages) ZMD

Part #	MDS751

Description	Package TSOP32 (I/8x20)

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Manufacturer	ZMD [Zentrum Mikroelektronik Dresden AG]

Direct Link	http://www.zmdi.com

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ZMD-Standard

December 2004

Package TSOP32 (I/8x20)

(Normal Option)

MDS

751

Zentrum Mikroelektronik Dresden

Editor: signature by Schoder

Date: 07.12.2004

Doc-No.

QS-000751-HD-02

Check: signature by Marx

Quality: signature by Tina Kochan

Dimensions in millimetres

Based on JEDEC: JEP95 MO-142

1 Dimensions

Dimensions of Sub-Group B1

Dimensions of Sub-Group C1

Amax

1,20

Amin

-

bPmin

0,17

A1min

0,05

bPmax

0,27

A1max

0,15

enom

0,50

A2min

0,90

HDmin

19,80

A2max

1,05

HDmax

20,20

cmin

0,10

LPmin

0,40

cmax

0,21

Dmin*

18,30

2Weight

≤ 0,3 g

Dmax*

18,50

3 Package Body Material

Low Stress Epoxy

Emin*

7,80

4 Lead Material

FeNi-Alloy or Cu-Alloy

Emax*8,20

5 Lead Finish

solder plating

θmin

0

°

6 Lead Form

Z-bends

θmax

5

°

* without mold-flash

Detail Z

LP

D

HD

Z

0,1

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MDS751 Datasheet(PDF) 1 Page - Zentrum Mikroelektronik Dresden AG

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