SN55LVDS32, SN65LVDS32, SN65LVDS3486, SN65LVDS9637

HIGHSPEED DIFFERENTIAL LINE RECEIVERS

SLLS262N − JULY 1997 − REVISED MARCH 2004

4

POST OFFICE BOX 655303

equivalent input and output schematic diagrams

300 k

Ω

300 k

Ω

VCC

7 V

7 V

A Input

B Input

7 V

50

Ω

VCC

Input

VCC

5

Ω

7 V

Y Output

EQUIVALENT OF EACH A OR B INPUT

EQUIVALENT OF G, G, 1,2EN OR

3,4EN INPUTS

TYPICAL OF ALL OUTPUTS

−0.5 V to 4 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−0.5 V to 4 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous total power dissipation

See Dissipation Rating Table

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

260

_C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−65

_C to 150_C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTE 1: All voltages, except differential I/O bus voltages, are with respect to the network ground terminal.

DISSIPATION RATING TABLE

PACKAGE

TA ≤ 25°C

POWER RATING

DERATING FACTOR‡

ABOVE TA = 25°C

TA = 70°C

POWER RATING

TA = 85°C

POWER RATING

TA = 125°C

POWER RATING

D (8)

725 mW

5.8 mW/

°C

464 mW

377 mW

—

D (16)

950 mW

7.6 mW/

°C

608 mW

494 mW

—

DGK

425 mW

3.4 mW/

°C

272 mW

221 mW

—

DGN§

2.14 W

17.1 mW/

°C

1.37 W

1.11 W

—

FK

1375 mW

11.0 mW/

°C

880 mW

715 mW

275 mW

J

1375 mW

11.0 mW/

°C

880 mW

715 mW

275 mW

PW (16)

774 mW

6.2 mW/

°C

496 mW

402 mW

—

W

1000 mW

8.0 mW/

°C

640 mW

520 mW

200 mW

‡ This is the inverse of the junction-to-ambient thermal resistance when board mounted and with no air flow.

§ The PowerPAD must be soldered to a thermal land on the printed-circuit board. See the application note PowerPAD Thermally Enhanced

Package (SLMA002)